1
Fred Pettinger, Carl White, Dave Marquardt, Sokol Ibrani, Eric Shero, Todd Dunn, Kyle Fondurulia, Mike Halpin: Process feed management for semiconductor substrate processing. ASM America, Snell & Wilmer, April 28, 2015: US09017481 (149 worldwide citation)

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...


2
John F Wengert, Ivo Raaijmakers, Mike Halpin, Loren Jacobs, Michael J Meyer, Frank van Bilsen, Matt Goodman, Eric Barrett, Eric Wood, Blake Samuels: Long life high temperature process chamber. ASM America, Knobbe Martens Olson & Bear, December 4, 2001: US06325858 (72 worldwide citation)

A generally horizontally-oriented quartz CVD chamber is disclosed with front and rear chamber divider plates adjacent a centrally positioned susceptor and surrounding temperature control ring which divide the chamber into upper and lower regions. Improvement to the lifetime of CVD process components ...


3
Ivo Raaijmakers, Loren Jacobs, Mike Halpin, Jim Alexander, Ken O Neill, Dennis Lee Goodwin: Substrate transfer system for semiconductor processing equipment. ASM America, Knobbe Martens Olson & Bear, May 30, 2000: US06068441 (35 worldwide citation)

A system for facilitating wafer transfer comprises a susceptor unit consisting of an inner susceptor section which rests within an outer susceptor section. A vertically movable and rotatable support spider located beneath the susceptor unit can rotate into positions to engage either the inner or the ...


4
Matt G Goodman, Jereon Stoutyesdijk, Ravinder Aggarwal, Mike Halpin, Tony Keeton, Mark Hawkins, Lee Haen, Armand Ferro, Paul Brabant, Robert Vyne, Gregory M Bartlett, Joseph P Italiano, Bob Haro: Substrate support system for reduced autodoping and backside deposition. ASM America, Knobbe Martens Olson & Bear, January 19, 2010: US07648579 (10 worldwide citation)

A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. A hollow ...


5
Loren Jacobs, Mike Halpin: Thermocouple. ASM America, Snell & Wilmer L, January 25, 2011: US07874726 (8 worldwide citation)

A thermocouple having a support tube configured to receive a pair of wires of dissimilar metals. The pair of wires of the thermocouple connected at a junction adjacent to one end of the support tube. The thermocouple further including a cap attached to the opposing end of the support tube, wherein t ...


6
Todd Dunn, Carl White, Mike Halpin, Eric Shero, Herbert Terhorst, Jerry Winkler: Pulsed valve manifold for atomic layer deposition. ASM AMERICA, Knobbe Martens Olson & Bear, February 21, 2017: US09574268 (5 worldwide citation)

A vapor deposition device includes a reactor including a reaction chamber and an injector for injecting vapor into the reaction chamber. The device also includes a manifold for delivering vapor to the injector. The manifold includes a manifold body having an internal bore, a first distribution chann ...


7
Buz Darabnia, Andy Yednak, Mike Halpin, Loren Jacobs, Ravinder Aggarwal: Thermocouple. ASM America, Snell & Wilmer L, September 11, 2012: US08262287 (4 worldwide citation)

A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wir ...


8
Fred Pettinger, Carl White, Dave Marquardt, Sokol Ibrani, Eric Shero, Todd Dunn, Kyle Fondurulia, Mike Halpin: Process feed management for semiconductor substrate processing. ASM America, Snell & Wilmer, February 13, 2018: US09892908 (3 worldwide citation)

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...


9
Buz Darabnia, Andy Yednak, Mike Halpin, Loren Jacobs, Ravinder Aggarwal: Thermocouple. ASM America, Snell & Wilmer, December 31, 2013: US08616765 (2 worldwide citation)

A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wir ...


10
Matt G Goodman, Jereon Stoutyesdijk, Ravinder Aggarwal, Mike Halpin, Tony Keeton, Mark Hawkins, Lee Haen, Armand Ferro, Paul Brabant, Robert Vyne, Gregory M Bartlett, Joseph P Italiano, Bob Haro: Substrate support system for reduced autodoping and backside deposition. ASM America, Knobbe Martens Olson & Bear, January 3, 2012: US08088225 (2 worldwide citation)

A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. A hollow ...