1
Warren M Farnworth, Alan G Wood, Mike Brooks: Semiconductor package including flex circuit, interconnects and dense array external contacts. Micron Technology, Stephen A Gratton, August 1, 2000: US06097087 (296 worldwide citation)

A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in e ...


2
Warren M Farnworth, Alan G Wood, Mike Brooks: Stacked semiconductor package and method of fabrication. Micron Technology, Stephen A Gratton, February 1, 2000: US06020629 (271 worldwide citation)

A semiconductor package and a method for fabricating the package are provided. The package includes multiple substrates in a stacked configuration, each having a semiconductor die mounted thereon. Each substrate includes matching patterns of external contacts and contact pads formed on opposing side ...


3
Warren M Farnworth, Salman Akram, Alan G Wood, Mike Brooks, Eugene Cloud: High density semiconductor package. Micron Technology, Stephen A Gratton, November 23, 1999: US05990566 (164 worldwide citation)

A semiconductor package and a method of fabrication are provided. The package includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate. Each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of the die. T ...


4
Warren M Farnworth, Alan G Wood, Mike Brooks: Method of wafer level chip scale packaging. Micron Technology, Stephen A Gratton, April 9, 2002: US06368896 (151 worldwide citation)

A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in e ...


5
Warren M Farnworth, Alan G Wood, Mike Brooks: Stackable semiconductor package having conductive layer and insulating layers and method of fabrication. Micron Technology, Stephen A Gratton, December 31, 2002: US06501165 (146 worldwide citation)

A semiconductor package includes a substrate and a semiconductor die wire bonded, or alternately flip chip bonded, to the substrate. The substrate includes three separate layers including a conductive layer having a pattern of conductive traces, a first insulating layer covering the conductive trace ...


6
Warren M Farnworth, Alan G Wood, Mike Brooks: Stackable semiconductor package having conductive layer and insulating layers. Micron Technology, Stephen A Gratton, September 2, 2003: US06614104 (133 worldwide citation)

A semiconductor package includes a substrate and a semiconductor die wire bonded, or alternately flip chip bonded, to the substrate. The substrate includes three separate layers including a conductive layer having a pattern of conductive traces, a first insulating layer covering the conductive trace ...


7
Warren M Farnworth, Alan G Wood, Mike Brooks: Semiconductor package including flex circuit, interconnects and dense array external contacts. Micron Technology, Stephen A Gratton, October 15, 2002: US06465877 (120 worldwide citation)

A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in e ...


8
Warren M Farnworth, Alan G Wood, Mike Brooks: Stackable semiconductor package having conductive layer and insulating layers and method of fabrication. Micron Technology, Stephen A Gratton, September 17, 2002: US06451624 (113 worldwide citation)

A semiconductor package includes a substrate and a semiconductor die wire bonded, or alternately flip chip bonded, to the substrate. The substrate includes three separate layers including a conductive layer having a pattern of conductive traces, a first insulating layer covering the conductive trace ...


9
Mike Brooks, Walter L Moden: Semiconductor package with heat sink and method of fabrication. Micron Technology, Stephen A Gratton, December 4, 2001: US06326242 (88 worldwide citation)

A semiconductor package and method for fabricating the package are provided. The package includes a semiconductor die and a heat sink in thermal communication with the die. The heat sink includes one or more pad structures adapted to form bonded connections, and thermal paths to contacts on a substr ...


10
Mike Brooks, Walter L Moden: Semiconductor package with heat sink and method of fabrication. Micron Technology, Stephen A Gratton, April 11, 2000: US06049125 (87 worldwide citation)

A semiconductor package and method for fabricating the package are provided. The package includes a semiconductor die and a heat sink in thermal communication with the die. The heat sink includes one or more pad structures adapted to form bonded connections, and thermal paths to contacts on a substr ...



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