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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 12, 2006: US07149095 (41 worldwide citation)

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the ...


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Lee Smith, Belgacem Haba, Glenn Urbish, Masud Beroz, Teck Gyu Kang: High-frequency chip packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2007: US07268426 (34 worldwide citation)

A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or comple ...


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Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 29, 2007: US07224056 (27 worldwide citation)

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Belgacem Haba, Masud Beroz: Microelectronic assemblies incorporating inductors. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 14, 2006: US07012323 (25 worldwide citation)

Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 19, 2009: US07534652 (6 worldwide citation)

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Methods of making microelectronic assemblies including folded substrates. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2003: US20030168725-A1 (1 worldwide citation)

A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.


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Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Tessera, LERNER DAVID et al, May 3, 2007: US20070096295-A1

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, IIyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070145550-A1

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Belgacem Haba, Masud Beroz: Microelectronic assemblies incorporating inductors. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 19, 2004: US20040032011-A1

Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a ...


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Belgacem Haba, Masud Beroz: Microelectronic assemblies incorporating inductors. Tessera, Tessera, LERNER DAVID et al, June 1, 2006: US20060113645-A1

Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a ...