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David G Figueroa, Michael Walk, Yuan Liang Li, Robert L Sankman: Electronic assembly with trench structures and methods of manufacture. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, May 14, 2002: US06388207 (86 worldwide citation)

To accommodate the operational and structural requirements of high performance integrated circuits, an integrated circuit package includes conductive trenches that are formed within a substrate. The trenches provide increased current carrying capacity, lower inductance, higher capacitance, and singl ...


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Kishore K Chakravorty, Michael Walk: Interposer substrate with low inductance capacitive paths. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, November 5, 2002: US06477034 (63 worldwide citation)

A thin film capacitor provides an interposer substrate between an integrated circuit die and an organic substrate. The interposer substrate includes a first conductive layer deposited on a base substrate layer. A portion of the first conductive layer provides a first electrode region serving as a fi ...


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Thomas S Dory, Michael Walk: Electronic packages and components thereof formed by substrate-imprinting. Intel Corporation, Schwegman Lundberg & Woessner P A, May 13, 2008: US07371975 (16 worldwide citation)

A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may be formed by imprinting them simult ...


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Boyd L Coomer, Michael Walk: Multi-layer integrated circuit package. Intel Corporation, Blakely Sokoloff Taylor & Zafman, May 31, 2005: US06899815 (4 worldwide citation)

Adhesive material is applied to a surface of a metallic core layer. The adhesive material is removed from a conductive region of the metallic core layer. A metallic contact is provided over the conductive region of the metallic core layer. The metallic core layer is laminated to an imprinted buildup ...


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Thomas S Dory, Michael Walk: Substrate-imprinting methods. Intel Corporation, Schwegman Lundberg & Woessner P A, September 29, 2009: US07594321 (1 worldwide citation)

A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may be formed by imprinting them simult ...


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Thomas S Dory, Michael Walk, Robert L Sankman, Boyd L Coomer: Methods for manufacturing imprinted substrates. Intel Corporation, Schwegman Lundberg & Woessner P A, December 29, 2009: US07637008

A package includes at least one electronic component mounted on an imprinted substrate. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Such features may be formed by imprinting in one operation rather than sequentially. Conductor fe ...


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Jiangqi He, Yuan Liang Li, Michael Walk: I/O Architecture for integrated circuit package. Intel Corporation, Buckley Maschoff & Talwalkar, September 15, 2009: US07589414

A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive elements of an integrated circuit die, and the second conductive elements may receive a first pluralit ...


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Boyd L Coomer, Michael Walk: Multi-layer integrated circuit package. Intel Corporation, Blakely Sokoloff Taylor & Zafman, July 17, 2007: US07245001

Adhesive material is applied to a surface of a metallic core layer. The adhesive material is removed from a conductive region of the metallic core layer. A metallic contact is provided over the conductive region of the metallic core layer. The metallic core layer is laminated to an imprinted buildup ...