1
Herbert P Byrnes, Jean Marc Halbout, Michael R Scheuermann, Eugene Shapiro: Thin interface pellicle for dense arrays of electrical interconnects. International Business Machines Corporation, Robert M Trepp, May 4, 1993: US05207585 (168 worldwide citation)

A thin interface pellicle probe for making temporary or permanent interconnections to pads or bumps on a semiconductor device wherein the pads or bumps may be arranged in high density patterns is described incorporating an electrode for each pad or bump wherein the electrode has a raised portion the ...


2
Ernest Bassous, Jean Marc Halbout, Subramanian S Iyer, Rajiv V Joshi, Vijay P Kesan, Michael R Scheuermann, Massimo A Ghioni: High speed silicon-based lateral junction photodetectors having recessed electrodes and thick oxide to reduce fringing fields. International Business Machines Corporation, Thomas P Dowd, Ronald L Drumheller, June 11, 1996: US05525828 (50 worldwide citation)

Silicon-VLSI-compatible photodetectors, in the form of a metal-semiconductor-metal photodetector (MSM-PD) or a lateral p-i-n photodetector (LPIN-PD), are disclosed embodying interdigitated metallic electrodes on a silicon surface. The electrodes of the MSM-PD have a moderate to high electron and hol ...


3
Jean Marc Halbout, Mark B Ketchen, Paul A Moskowitz, Michael R Scheuermann: Detachable high-speed opto-electronic sampling probe. International Business Machines Corporation, John J Goodwin, July 25, 1989: US04851767 (28 worldwide citation)

A testing or sampling probe to determine the response of electrical circuits or devices to ultrafast electrical pulses. The probe is detachable from the device being tested. The probe includes a transparent substrate though which optical pulses are focused or directed onto a photoconducting gap. The ...


4
Alfred Viehbeck, Stephen L Buchwalter, William A Donson, John J Glenning, Martin J Goldberg, Kurt R Grebe, Caroline A Kovac, Linda C Matthew, Walter P Pawlowski, Mark J Schadt, Michael R Scheuermann, Stephen L Tisdale: Method for conditioning an organic polymeric material. International Business Machines Corporation, Pollock Vande Sande & Priddy, September 7, 1993: US05242713 (14 worldwide citation)

Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric materi ...


5
Michael R Scheuermann, Joel A Silberman, Matthew R Wordeman: Configuration of connections in a 3D stack of integrated circuits. International Business Machines Corporation, Tutunjian & Bitetto P C, Louis J Percello, July 2, 2013: US08476771 (3 worldwide citation)

There is provided a connection configuration for a multiple layer chip stack having two or more strata. Each of the two or more strata has multiple circuit components, a front-side and a back-side. The connection configuration includes a connection pair having as members a front-side connection and ...


6
Pradip Bose, Gary D Carpenter, Michael S Floyd, Eren Kursun, Phillip J Restle, Michael R Scheuermann: Vertical power budgeting and shifting for three-dimensional integration. International Business Machines Corporation, Tutunjian & Bitetto P C, Louis J Percello, August 20, 2013: US08516426 (3 worldwide citation)

A method is provided for managing power distribution on a three-dimensional chip stack having two or more strata, a plurality of vertical power delivery structures, and multiple stack components. At least two stack components are on different strata. Operating modes are stored that respectively have ...


7
Michael P Beakes, Shih Hsien Lo, Michael R Scheuermann, Matthew R Wordeman: 3D inter-stratum connectivity robustness. International Business Machines Corporation, Tutunjian & Bitetto P C, Louis J Percello, February 19, 2013: US08381156 (2 worldwide citation)

There is provided a method for verifying inter-stratum connectivity for two or more strata to be combined into a 3D chip stack. Each of the two or more strata has 3D elements including active 3D elements, mechanical 3D elements, and dummy 3D elements. The method includes performing a respective 2D l ...


8
Christopher J Berry, Michael A Bowen, Michael R Scheuermann, Michael H Wood: Process for managing complex pre-wired net segments in a VLSI design. International Business Machines Corporation, William A Kinnaman Jr, March 16, 2010: US07681169 (1 worldwide citation)

A method for pre-wiring through multiple levels of metal using flues includes steps of: receiving information comprising flue geometries and flue properties; producing multiple routing patterns of a design for the flues; identifying macro instance terminals to be pre-wired in the design; selecting a ...


9
Christopher J Berry, Michael A Bowen, Michael R Scheuermann, Michael H Wood: Process for Managing Complex Pre-Wired Net Segments in a VLSI Design. International Business Machines Corporation, International Business Machines Corporation, March 5, 2009: US20090064081-A1

A method for pre-wiring through multiple levels of metal using flues includes steps of: receiving information comprising flue geometries and flue properties; producing multiple routing patterns of a design for the flues; identifying macro instance terminals to be pre-wired in the design; selecting a ...


10
Gary D Carpenter, Eren Kursun, Phillip J Restle, Michael R Scheuermann: Hindering Side-Channel Attacks in Integrated Circuits. International Business Machines Corporation, May 17, 2012: US20120124669-A1

A mechanism is provided for protecting a layer of functional units from side-channel attacks. A determination is made as to whether one or more subsets of functional units in a set of functional units in the layer of functional units is performing operations of a critical nature. Responsive to a det ...