1
John C Carson, Robert E DeCaro, Ying Hsu, Michael K Miyake: Stackable modules and multimodular assemblies. Irvine Sensors Corporation, Plante & Strauss, December 23, 1997: US05701233 (142 worldwide citation)

Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the ...


2
Michael K Miyake: Non-conductive end layer for integrated stack of IC chips. Irvine Sensors Corporation, Thomas J Plante, June 13, 1995: US05424920 (91 worldwide citation)

An integrated stack of layers incorporating a plurality of IC chip layers has an end layer which is formed of dielectric material (or covered with such material). The outer surface of the end layer provides a substantial area for the spaced location of a multiplicity of lead-out terminals, to which ...