1
Dana Gronbeck Jeffrey Calvert
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Electronic devices having air gaps. Rohm and Haas Electronic Materials, Jonathan D Baskin, May 25, 2010: US07723850 (9 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


2
John Amara
John P Amara, Nicola Pugliano, Jin Wuk Sung, Michael K Gallagher, Michael S Castorano: Coating compositions for use with an overcoated photoresist. Rohm and Haas Electronic Materials, Peter F Corless, Rohm and Haas Electronic Materials, June 11, 2009: US20090148789-A1

In one aspect, the invention relates to silicon-containing organic coating compositions, particularly antireflective coating compositions, that contain a repeat unit wherein chromophore moieties such as phenyl are spaced from Si atom(s). In another aspect, silicon-containing underlayer compositions ...


3
Dana Gronbeck
Dana A Gronbeck, Michael K Gallagher, Jeffrey M Calvert, Gregory P Prokopowicz, Timothy G Adams: Electronic device manufacture. Shipley Company L L C, S Matthew Cairns, March 28, 2006: US07018678 (31 worldwide citation)

Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.


4
Dana Gronbeck
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Air gap formation. Shipley Company L L C, Jonathan D Baskin, August 14, 2007: US07256127 (25 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


5
Dana Gronbeck
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Air gap formation. Shipley Company, Edwards & Angell, July 15, 2004: US20040137728-A1 (2 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


6
Dana Gronbeck
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Air gap formation. Shipley Company, Jonathan D Baskin, Rohm and Haas Electronic Materials, February 14, 2008: US20080038518-A1

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


7
Dana Gronbeck
Dana A Gronbeck, Michael K Gallagher, Jeffrey M Calvert, Christopher P Sullivan: Electronic device manufacture. Shipley Company, S Matthew Cairns, c o EDWARDS & ANGELL, March 18, 2004: US20040052948-A1

Treatment procedures for organic polysilica layers are provided that improve the adhesion of layers of material that are subsequently applied to the treated organic polysilica layers. In particular, layers of organic polymeric material have improved adhesion to such treated organic polysilica layers ...


8
Maricela Morales
Deyan Wang, Peter Trefonas, Michael K Gallagher: Coating compositions for photoresists. Rohm and Haas Electronic Materials, Peter F Corless, Rohm and Haas Electronic Materials, July 12, 2007: US20070160930-A1

In one aspect, the present invention relates to coating compositions that comprise a resin component, wherein the predominant portion of the resin component comprising one or more resins that are at least substantially free of fluorine. Coating compositions of the invention are useful as photoresist ...


9
Dana Gronbeck
Dana A Gronbeck, Michael K Gallagher, Jeffrey M Calvert, Gregory P Prokopowicz, Timothy G Adams: Electronic device manufacture. Shipley Company, Edwards & Angell, February 19, 2004: US20040033700-A1

Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.


10
Dana Gronbeck
Dana A Gronbeck, Amy M Kwok, Chi Q Truong, Michael K Gallagher, Anthony Zampini: Antireflective hard mask compositions. Rohm And Haas Electronic Materials, Peter F Corless, Rohm and Haas Electronic Materials, November 25, 2010: US20100297539-A1

The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred ...