1
Kenneth Smith, Michael Jolley, Victoria Van Syckel: Probe head having a membrane suspended probe. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, May 6, 2008: US07368927 (37 worldwide citation)

A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for contacting a device under test. A beam ...


2
Brian Aegerter, Curt T Dundas, Michael Jolley, Tom L Ritzdorf, Steven L Peace, Gary L Curtis, Raymon F Thompson: Selective treatment of the surface of a microelectronic workpiece. Semitool, Lyon & Lyon, July 2, 2002: US06413436 (24 worldwide citation)

In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more ...


3
Brian K Aegerter, Curt T Dundas, Tom L Ritzdorf, Gary L Curtis, Michael Jolley: Selective treatment of microelectronic workpiece surfaces. Semitool, Christensen O&apos Connor Johnson Kindness PLLC, October 14, 2003: US06632292 (17 worldwide citation)

This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Excl ...


4
Brian K Aegerter, Curt T Dundas, Tom L Ritzdorf, Gary L Curtis, Michael Jolley, Steven L Peace: Selective treatment of microelectric workpiece surfaces. Semitool, Klarquist Sparkman, July 15, 2008: US07399713 (14 worldwide citation)

This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Excl ...


5
Kenneth Smith, Michael Jolley, Victoria Van Syckel: Probe head having a membrane suspended probe. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, April 7, 2009: US07514944 (7 worldwide citation)

A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for contacting a device under test. A beam ...


6
Brian K Aegerter, Curt T Dundas, Tom L Ritzdorf, Gary L Curtis, Michael Jolley: Methods and apparatus for rinsing and drying. Semitool, Kenneth H Ohriner, Perkins Coie, September 30, 2008: US07429537 (6 worldwide citation)

A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via cen ...


7
Michael Jolley: Method for cleaning copper surfaces. Semitool, Lyon & Lyon, April 17, 2001: US06217667 (2 worldwide citation)

In a method for cleaning a copper surface of a semiconductor wafer or article, nitrogen gas is bubbled or dissolved into a strong alkaline solution, displacing dissolved oxygen from the solution. A nitrogen gas environment is provided over the copper surface. The alkaline solution is then applied to ...


8
Michael Jolley: Method for cleaning copper surfaces. Semitool, Christensen O&apos Connor Johnson Kindness PLLC, October 14, 2003: US06632288 (1 worldwide citation)

In a method for cleaning a copper surface of a semiconductor wafer or article, nitrogen gas is bubbled or dissolved into a strong alkaline solution, displacing dissolved oxygen from the solution. A nitrogen gas environment is provided over the copper surface. The alkaline solution is then applied to ...


9
Michael Jolley: Method for cleaning copper surfaces. Semitool, Christensen O Connor Johnson Kindness Pllc, September 6, 2001: US20010018922-A1

In a method for cleaning a copper surface of a semiconductor wafer or article, nitrogen gas is bubbled or dissolved into a strong alkaline solution, displacing dissolved oxygen from the solution. A nitrogen gas environment is provided over the copper surface. The alkaline solution is then applied to ...


10
Brian K Aegerter, Curt T Dundas, Tom L Ritzdorf, Gary L Curtis, Michael Jolley: Selective treatment of microelectronic workpiece surfaces. Keith V Rockey, Wallenstein Wagner & Rockey, February 26, 2004: US20040035448-A1

This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Excl ...