1
David F Brown, Michael J Anstey: Semiconductor chip carrier. Leydig Voit & Mayer, January 20, 1987: US04638348 (64 worldwide citation)

A circuit unit such as performing the function of a chip carrier. In one example, it is in the form of a thin square of insulating material having contact pads arranged side by side along the four edges of both major surfaces. The chip is secured substantially centrally of the insulating material an ...


2
David F Brown, Michael J Anstey: Circuit assembly. Watson Cole Grindle & Watson, February 26, 1985: US04502098 (46 worldwide citation)

A circuit assembly includes a mounting structure 10 having walls 11-13, 20 with conductor strips 19 running along the length of the structure. Plate members 14 carrying components such as integrated circuits 16 have conductive areas 18 which contact the conductor strips 19 when the members are inser ...


3
David F Brown, Michael J Anstey: Circuit assembly. Dowty Electronic Components, Watson Cole Grindle & Watson, April 18, 1989: US04823233 (32 worldwide citation)

A circuit assembly includes a mounting structure 10 having walls 11-13, 20 with conductor strips 19 running along the length of the structure. Plate members 14 carrying components such as integrated circuits 16 have conductive areas 18 which contact the conductor strips 19 when the members are inser ...


4
Michael J Anstey, David F Brown: Back-up electrical power supplies. Racal Microelectronic Systems, Leydig Voit Osann Mayer & Holt, April 26, 1983: US04381458 (21 worldwide citation)

A back-up electrical power supply module provides a back-up supply for a plug-in volatile electrical device such as a memory module. The memory module has a dual-in-line pins which engage socket openings of a standard dual-in-line circuit board connector. The back-up supply module is mounted on top ...


5
Michael J Anstey: Interconnection systems for electrical circuits. Dowty Electronic Components, Leydig Voit & Mayer, October 10, 1989: US04872843 (12 worldwide citation)

Electrical circuits can be built up in three dimensions by using spacers (20, 20') which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks (120) which have a number of continuous tracks ...


6
Michael J Anstey: Interconnection systems for electrical circuits. Dowty Electronic Components, Leydig Voit & Mayer, February 12, 1991: US04991927 (8 worldwide citation)

Electrical circuits can be built up in three dimensions by using spacers which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks which have a number of continuous tracks. Link members ar ...