1
Romarico S San Antonio, Michael H McKerreghan, Anang Subagio, Allan C Toriaga, Lenny Christina Gultom: RF shielding for a singulated laminate semiconductor device package. Unisem, Wiggin and Dana, December 27, 2011: US08084300 (20 worldwide citation)

A method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substrate is disposed on a tape; the mold ...


2
Shafidul Islam, Daniel K Lau, Romarico S San Antonio, Anang Subagio, Michael H McKerreghan, Edmunda G O Litilit: Semiconductor device package and method for manufacturing same. Unisem, Wiggin and Dana, July 21, 2009: US07563648 (14 worldwide citation)

A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed ...


3
Romarico S San Antonio, Michael H McKerreghan, Anang Subagio, Allan C Toriaga: Partially patterned lead frames and methods of making and using the same in semiconductor packaging. Unisem, White & Case, August 7, 2012: US08236612 (8 worldwide citation)

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manuf ...


4
Michael H McKerreghan, Shafidul Islam, Romarico S San Antonio: Package having exposed integrated circuit device. Unisem, Wiggin and Dana, June 30, 2009: US07554180 (2 worldwide citation)

A package (10) includes an integrated circuit device (12) having an electrically active surface (16) and an opposing backside surface (14). A dielectric molding resin (26) at least partially encapsulates the integrated circuit die and the plurality of electrically conductive leads (20) with the back ...


5
Michael H McKerreghan, Shafidul Islam, Romarico S San Antonio: Package having exposed integrated circuit device. Unisem, Wiggin and Dana, November 8, 2011: US08053869 (1 worldwide citation)

A package (10) includes an integrated circuit device (12) having an electrically active surface (16) and an opposing backside surface (14). A dielectric molding resin (26) at least partially encapsulates the integrated circuit die and the plurality of electrically conductive leads (20) with the back ...


6
Shafidul Islam, Daniel K Lau, Romarico S San Antonio, Anang Subagio, Michael H McKerreghan, Edmunda G O Litilit: Semiconductor device package and method for manufacturing same. Wiggin And Dana, July 12, 2007: US20070161157-A1

A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed ...


7
Michael H McKerreghan, Shafidul Islam, Rico San Antonio: Package having exposed integrated circuit device. Wiggin And Dana, June 28, 2007: US20070145547-A1

A package (10) includes an integrated circuit device (12) having an electrically active surface (16) and an opposing backside surface (14). A dielectric molding resin (26) at least partially encapsulates the integrated circuit die and the plurality of electrically conductive leads (20) with the back ...


8
Michael H McKerreghan, Shafidul Islam, Romarico S San Antonio: Package Having Exposed Integrated Circuit Device. Wiggin And Dana, August 27, 2009: US20090215244-A1

A package (10) includes an integrated circuit device (12) having an electrically active surface (16) and an opposing backside surface (14). A dielectric molding resin (26) at least partially encapsulates the integrated circuit die and the plurality of electrically conductive leads (20) with the back ...


9
Romarico S San Antonio, Michael H McKerreghan, Anang Subagio, Allan C Toriaga: Semiconductor device package with electromagnetic shielding. Unisem, May 24, 2012: US20120126378-A1

A package for a semiconductor device includes shielding from RF interference. The package has a lead frame with a lead and a connecting bar. The lead has an inner end for connecting to the device and an outer end having an exposed surface at the package side face. The connecting bar also has an end ...


10
Romarico S San Antonio, Michael H McKerreghan, Anang Subagio, Allan C Toriaga: Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging. May 12, 2011: US20110111562-A1

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manuf ...