1
Paul T Lin, Michael B McShane, Howard P Wilson: Semiconductor device having a pad array carrier package. Motorola, Jasper W Dockrey, June 1, 1993: US05216278 (527 worldwide citation)

A semiconductor device (10) having first and second wiring layers (30, 33) on opposite surfaces of a carrier substrate (12) interconnected through vias (32) formed in the carrier substrate (12) electrically coupling an electronic component (18) to a mounting substrate through compliant solder balls ...


2
Paul T Lin, Michael B McShane, Sugio Uchida, Takehi Sato: Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film. Motorola, Jasper W Dockrey, April 6, 1993: US05200362 (305 worldwide citation)

A semiconductor device and a method for its fabrication are disclosed. In a preferred embodiment, a pattern of conductive traces is formed on a film of transfer material. A semiconductor device die is interconnected to the pattern of conductive traces and a resin body is formed around the die, one s ...


3
Michael B McShane, Paul T Lin: Semiconductor device having dual electrical contact sites. Motorola, Patricia S Goddard, October 20, 1992: US05157480 (273 worldwide citation)

A semiconductor device having both bottom-side contacts and peripheral contacts provides surface mounting options. In one form, a semiconductor device die is positioned at a die receiving area of a leadframe. The leadframe also has a plurality of leads, each lead having a first and a second contact ...


4
Paul T Lin, Michael B McShane: Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film. Motorola, Patricia S Goddard, December 28, 1993: US05273938 (272 worldwide citation)

A low cost manufacturing method is used to fabricate a small multichip semiconductor device (30). In one embodiment, a pattern of conductive traces (13) is formed on a film of transfer material (12). A first semiconductor die (15) is interconnected to the traces and a resin body (20) is formed aroun ...


5
Paul T Lin, Michael B McShane: Overmolded semiconductor device having solder ball and edge lead connective structure. Motorola, James L Clingan Jr, August 24, 1993: US05239198 (272 worldwide citation)

A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is formed on a second surface of the substrate (12). A ...


6
Michael B McShane: Molded electronic package with compression structures. Motorola, Jasper W Dockrey, John A Fisher, August 20, 1991: US05041902 (251 worldwide citation)

A molded package having reduced unintentional and undesirable mold flash or bleed around an exposed heat sink is provided through the use of a compression structure within the package. The compression structure may be integral with a heat sink, die bond flag, if one is present, or may be a separate ...


7
Paul T Lin, Michael B McShane: Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding. Motorola, Patricia S Goddard, November 21, 1995: US05468999 (183 worldwide citation)

A ball grid array semiconductor device (10) includes a package substrate (14 or 16) having a plurality of conductive traces (18), bond posts (20), and conductive vias (22). A semiconductor die (12) is mounted to the package substrate. Orthogonal wire bonds (28) are used to electrically connect stagg ...


8
Charles G Bigler, Alan H Woosley, Michael B McShane: Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same. Motorola, Minh Hien N Clark, May 14, 1996: US05517056 (179 worldwide citation)

A leadframe (30) having a novel resin injecting area (44) is disclosed to facilitate and control the removal of a molded gate (18) prior to excising a semiconductor device(70) from a carrier ring (14). The carrier ring has a corner which is on a diagonal with a corner of the package body (12) to for ...


9
Paul T Lin, Michael B McShane: Stacking three dimensional leadless multi-chip module and method for making the same. Motorola, James L Clingan Jr, September 21, 1993: US05247423 (177 worldwide citation)

A stackable three dimensional leadless multi-chip module (10) is provided whereby each level of semiconductor device (11) is interconnected to another level through reflowing of solder plated wires (22). Each semiconductor device (11) contains a semiconductor die (24) overmolded by a package body (1 ...


10
Paul T Lin, Michael B McShane: Thermally enhanced semiconductor device having exposed backside and method for making the same. Motorola, Minh Hien N Clark, September 12, 1995: US05450283 (161 worldwide citation)

A thermally enhanced semiconductor device (10) having an exposed backside (22) is described. In one embodiment, a PC board substrate (12) is provided having a pattern of conductive traces (14) on both upper and lower surfaces of the substrate. Electrical continuity is maintained between the two surf ...