1
Michael Anthony Gaynes, Alan James Emerick, Viswanadham Puligandla, Charles Gerard Woychik, Jerzy Maria Zalesinski: High density integrated circuit packaging with chip stacking and via interconnections. International Business Machines Corporation, Ron Kaschak, Whitham Curtis & Whitham, December 14, 1999: US06002177 (250 worldwide citation)

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which ma ...


2
Michael Anthony Gaynes, Alan James Emerick, Viswanadham Puligandla, Charles Gerard Woychik, Jerzy Maria Zalesinski: High density integrated circuit packaging with chip stacking and via interconnections. International Business Machines Corporation, Ron Kaschak, McGuirewoods, May 22, 2001: US06236115 (213 worldwide citation)

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which ma ...


3
Michael Anthony Gaynes, Alan James Emerick, Viswanadham Puligandla, Charles Gerard Woychik, Jerzy Maria Zalesinski: High density integrated circuit packaging with chip stacking and via interconnections. International Business Machines Corporation, Ronald A Kaschak, McGuireWoods, February 13, 2001: US06187678 (188 worldwide citation)

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which ma ...


4
Michael Anthony Gaynes, Mark Vincent Pierson: Method of making components with solder balls. International Business Machines Corporation, John R Pivnichny, December 26, 2000: US06165885 (121 worldwide citation)

An electronic component with solder ball connections is provided. A stencil is produced with holes passing through it in an arrangement corresponding to an arrangement of conductive pads on a substrate or integrated circuit. The stencil is made of a solder reflow compatible material. A layer of adhe ...


5
Thomas Moran Culnane, Michael Anthony Gaynes, Ping Kwong Seto, Hussain Shaukatullah: Chip carrier modules with heat sinks attached by flexible-epoxy. International Business Machines Corporation, Whitham Curtis Whitham & McGinn, April 28, 1998: US05744863 (118 worldwide citation)

An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especilly useful for CQ ...


6
Thomas Moran Culnane, Michael Anthony Gaynes, Ping Kwong Seto, Hussain Shaukatullah: Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy. International Business Machines Corporation, John Pivnichny, Whitham Curtis Whitham & McGinn, September 30, 1997: US05672548 (89 worldwide citation)

An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especilly useful for CQ ...


7
William Emmett Bernier, Michael Anthony Gaynes, Irving Memis, Hussain Shaukatuallah: Attaching heat sinks directly to flip chips and ceramic chip carriers. International Business Machines Corporation, Pollock Vande Sande & Priddy, December 8, 1998: US05847929 (61 worldwide citation)

An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel or gold on chromium. Such structures are especia ...


8
David James Alcoe, Jeffrey Thomas Coffin, Michael Anthony Gaynes, Harvey Charles Hamel, Mario J Interrante, Brenda Lee Peterson, Megan J Shannon, William Edward Sablinski, Christopher Todd Spring, Randall Joseph Stutzman, Renee L Weisman, Jeffrey Allen Zitz: EMI shielding for semiconductor chip carriers. International Business Machines Corporation, William H Steinberg Esq, Scully Scott Murphy & Presser, May 25, 2004: US06740959 (55 worldwide citation)

Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.


9
Kenneth Raymond Carter, Craig Jon Hawker, James Lupton Hedrick, Robert Dennis Miller, Michael Anthony Gaynes, Stephen Leslie Buchwalter: Reworkable thermoplastic encapsulant. International Business Machines Corporation, Daniel P Morris, Scully Scott Murphy & Presser, August 29, 2000: US06111323 (50 worldwide citation)

The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the ...


10
William Emmett Bernier, Michael Anthony Gaynes, Irving Memis, Hussain Shaukatuallah: Attaching heat sinks directly to flip chips and ceramic chip carriers. International Business Machines Corporation, Pollock Vande Sande & Amernick, May 30, 2000: US06069023 (49 worldwide citation)

An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicon or flexible-epoxy adhesive. The aluminum may be coated by anodizing or Chromate conversion or the copper may be coated with nickel or gold Chromium. Such structures are especially ...