1
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof. International Business Machines Corporation, Daniel P Morris, October 13, 1998: US05821763 (235 worldwide citation)

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compli ...


2
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yaun Shih: High density cantilevered probe for electronic devices. International Business Machines Corporation, Daniel P Morris, September 22, 1998: US05811982 (199 worldwide citation)

Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which exte ...


3
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: High density integrated circuit apparatus, test probe and methods of use thereof. International Business Machines Corporation, Daniel P Morris, January 1, 2002: US06334247 (170 worldwide citation)

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compli ...


4
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: High density integrated circuit apparatus, test probe and methods of use thereof. International Business Machines Corporation, Daniel P Morris, October 9, 2001: US06300780 (149 worldwide citation)

A high density test probe for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packagi ...


5
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih: High density test probe with rigid surface structure. International Business Machines Corporation, Daniel P Morris, May 16, 2000: US06062879 (112 worldwide citation)

The present invention is a structure for probing an electronic device. The structure has a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from the first side to the second side; each of the electrical conductors has a first end and ...


6
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih: High density test probe with rigid surface structure. International Business Machines Corporation, Daniel P Morris, July 28, 1998: US05785538 (111 worldwide citation)

The present invention is a structure for probing an electronic device. The structure has a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from the first side to the second side; each of the electrical conductors has a first end and ...


7
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih: High density cantilevered probe for electronic devices. International Business Machines Corporation, Daniel P Morris, June 22, 1999: US05914614 (90 worldwide citation)

Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which exte ...


8
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: High density integrated circuit apparatus, test probe and methods of use thereof. International Business Machines Corporation, Daniel P Morris, May 26, 2009: US07538565 (77 worldwide citation)

A high density test probe which provides an apparatus for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric ...


9
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih: High density cantilevered probe for electronic devices. International Business Machines Corporation, Daniel P Morris, December 11, 2001: US06329827 (75 worldwide citation)

Connectors for electronic devices are described. The connector is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs wh ...


10
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: Integral rigid chip test probe. International Business Machines Corporation, Daniel P Morris, November 17, 1998: US05838160 (74 worldwide citation)

The present invention is directed to probe structures for testing of electrical interconnections to integrated circuit devices and other electronic components and particularly to testing integrated circuit devices with high density area array solder ball interconnections. The probe structure is form ...