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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: Method of making assemblies having stacked semiconductor chips. Tessera, Lerner David Litenberg Krumholz & Mentlik, October 20, 2005: US20050233496-A1

A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for moun ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, IIyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, April 5, 2007: US20070077677-A1

A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, David B Tuckerman, Glenn Urbish, Masud Beroz, Ilyas Mohammed: Chip handling methods and apparatus. Tessera, Tessera, LERNER DAVID et al, January 19, 2006: US20060013680-A1

An array of chips spaced apart from one another by chip spacing distances, as, for example, an array of chips on a wafer dicing tape is juxtaposed with an array of chip receiving elements spaced apart from one another by receiving element spacing distances different from the chip spacing distances, ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: Assemblies having stacked semiconductor chips and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 2, 2004: US20040238931-A1

A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for moun ...


45
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Masud Beroz: Stacked Packaging Improvements. Tessera, Tessera, LERNER DAVID et al, April 23, 2009: US20090104736-A1

A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, October 14, 2010: US20100258956-A1

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Belgacem Haba, Masud Beroz: Microelectronic assemblies incorporating inductors. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 19, 2004: US20040032011-A1

Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Masud Beroz: Stacked packaging improvements. Tessera, Tessera, LERNER DAVID et al, February 24, 2011: US20110042810-A1

A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substra ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates. Tessera, Tessera, LERNER DAVID et al, June 29, 2006: US20060138640-A1

A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba, Klaus Jurgen Wolter: Microelectronic joining processes. Lerner David Littenberg Krumholz & Mentlik, March 6, 2003: US20030041451-A1

A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part by a flexible film. Atmospheric pressure on th ...