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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M Pickett, John Smith: Microelectronic unit forming methods and materials. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 26, 2002: US06361959 (34 worldwide citation)

Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are rel ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba, Christopher M Pickett: Lead formation using grids. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 7, 2002: US06384475 (33 worldwide citation)

A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The top and bottom ele ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: Multilayer structure with interlocking protrusions. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 13, 2001: US06188028 (28 worldwide citation)

A multilayer structure includes a plurality of stacked circuit panels interconnected by posts extending through each panel. Circuit traces provided on one or both surfaces of each circuit panel interconnect the connectors in a predetermined pattern. The connectors are provided with a blind via which ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 13, 2007: US07176043 (26 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away f ...


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Belgacem Haba, Masud Beroz: Microelectronic assemblies incorporating inductors. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 14, 2006: US07012323 (24 worldwide citation)

Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba, Christopher M Pickett: Lead formation usings grids. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 16, 2000: US06063648 (23 worldwide citation)

A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The top and bottom ele ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: Microelectronic joining processes with temporary securement. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 8, 2003: US06543131 (23 worldwide citation)

A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending between the microelectronic elements and components and adhering to the elements and components. Condu ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba, Klaus Jurgen Wolter: Microelectronic joining processes. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 25, 2003: US06651321 (18 worldwide citation)

A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectonic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 29, 2010: US07745943 (17 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M Pickett, John Smith: Microelectronic unit forming methods and materials. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 18, 2004: US06737265 (17 worldwide citation)

Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive structure is ...