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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: Components with conductive solder mask layers. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2001: US06329605 (102 worldwide citation)

A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in prox ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 2, 2011: US07989940 (50 worldwide citation)

A multi-layer electronic package having polymeric tape layers, where at least one of the polymeric tape layers has a via, through hole, or aperture therein to pass wiring between the layers. This enables a balance of package size, adhesive thickness, chip access, inventory management, package width, ...


3
Belgacem Haba Belgacem (Bel) Haba
Joseph Fjelstad, Masud Beroz, John W Smith, Belgacem Haba: Microelectric packages having deformed bonded leads and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 1, 2005: US06848173 (40 worldwide citation)

A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on th ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Masud Beroz: Stacked packaging improvements. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 3, 2013: US08525314 (39 worldwide citation)

A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: Assemblies having stacked semiconductor chips and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 6, 2005: US06940158 (38 worldwide citation)

A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for moun ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 18, 2008: US07453157 (36 worldwide citation)

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelect ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2012: US08329581 (35 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 9, 2008: US07462936 (35 worldwide citation)

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Lee Smith, Belgacem Haba, Glenn Urbish, Masud Beroz, Teck Gyu Kang: High-frequency chip packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2007: US07268426 (34 worldwide citation)

A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or comple ...


10
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M Pickett, John Smith: Microelectronic unit forming methods and materials. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 26, 2002: US06361959 (34 worldwide citation)

Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are rel ...



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