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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: Components with conductive solder mask layers. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2001: US06329605 (105 worldwide citation)

A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in prox ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 2, 2011: US07989940 (52 worldwide citation)

A multi-layer electronic package having polymeric tape layers, where at least one of the polymeric tape layers has a via, through hole, or aperture therein to pass wiring between the layers. This enables a balance of package size, adhesive thickness, chip access, inventory management, package width, ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Masud Beroz: Stacked packaging improvements. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 3, 2013: US08525314 (45 worldwide citation)

A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 18, 2008: US07453157 (41 worldwide citation)

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelect ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 9, 2008: US07462936 (40 worldwide citation)

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


6
Belgacem Haba Belgacem (Bel) Haba
Joseph Fjelstad, Masud Beroz, John W Smith, Belgacem Haba: Microelectric packages having deformed bonded leads and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 1, 2005: US06848173 (40 worldwide citation)

A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on th ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Giles Humpston, Jae M Park: Microelectronic package comprising offset conductive posts on compliant layer. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 26, 2012: US08207604 (38 worldwide citation)

A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from t ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: Assemblies having stacked semiconductor chips and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 6, 2005: US06940158 (38 worldwide citation)

A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for moun ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2012: US08329581 (36 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


10
Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Lee Smith, Belgacem Haba, Glenn Urbish, Masud Beroz, Teck Gyu Kang: High-frequency chip packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2007: US07268426 (34 worldwide citation)

A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or comple ...



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