1
Katsuyuki Musaka
Masayuki Kumekawa, Norio Kimura, Yukio Fukunaga, Katsuyuki Musaka: Electrolytic processing apparatus. Squire Sanders & Dempsey, February 15, 2007: US20070034502-A1

An electrolytic processing apparatus is used to remove a metal film formed on a surface of a substrate. The electrolytic processing apparatus includes a feeding electrode 31 for feeding electricity to a metal film 6 on a substrate W, a processing electrode 32 for processing the metal film 6, a subst ...


2
Katsuyuki Musaka
Masayuki Kumekawa, Norio Kimura, Yukio Fukunaga, Katsuyuki Musaka, Hariklia Deligianni, Emanuel Israel Cooper, Philippe Mark Vereecken: Electrolytic processing method. Squire Sanders & Dempsey, February 15, 2007: US20070034525-A1

An electrolytic processing method is used to remove a metal film formed on a surface of a substrate. The electrolytic processing method includes providing a feeding electrode 31 and a processing electrode 32 on a table 12, providing an insulating member 36 between the feeding electrode and the proce ...


3
Satoshi Sendai, Akihisa Hongo, Kenya Tomioka, Katsumi Tsuda, Masayuki Kumekawa, Naoaki Ogure, Kenichi Sasabe: Method and apparatus for plating substrate and plating facility. Ebara Corporation, Wenderoth Lind & Ponack L, May 6, 2003: US06558518 (9 worldwide citation)

A substrate such as a semiconductor wafer is plated to fill a metal such as copper (Cu) or the like in interconnection grooves defined in the substrate. An apparatus for plating such a substrate has a plating chamber for holding a plating solution, the plating chamber housing an anode that is immers ...


4
Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda: Substrate processing apparatus and method. Ebara Corporation, Wenderoth Lind & Ponack L, April 24, 2007: US07208076 (5 worldwide citation)

A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an ...


5
Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda: Electrolytic processing device and substrate processing apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, September 5, 2006: US07101465 (5 worldwide citation)

There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of spaces between the workpiece and the processing ...


6
Satoshi Sendai, Kenya Tomioka, Katsumi Tsuda, Masayuki Kumekawa, Koji Mishima: Plating apparatus and method. Ebara Corporation, Wenderoth Lind & Ponack L, January 23, 2007: US07166204 (2 worldwide citation)

A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid in which an anode is immersed, a h ...


7
Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Masayuki Kumekawa, Hozumi Yasuda, Osamu Nabeya, Kazuto Hirokawa, Mitsuhiko Shirakashi, Yasushi Toma, Itsuki Kobata: Method and device for regenerating ion exchanger, and electrolytic processing apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, September 23, 2008: US07427345 (2 worldwide citation)

A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regene ...


8
Osamu Nabeya, Masayuki Kumekawa, Hozumi Yasuda, Itsuki Kobata, Takeshi Iizumi, Nobuyuki Takada, Koichi Fukaya, Mitsuhiko Shirakashi, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita: Electrolytic processing apparatus and electrolytic processing method. Ebara Corporation, Wenderoth Lind & Ponack L, December 29, 2009: US07638030 (1 worldwide citation)

An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the sur ...


9
Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama: Substrate polishing apparatus and method. Ebara Corporation, Wenderoth Lind & Ponack L, September 8, 2009: US07585205 (1 worldwide citation)

A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishin ...


10
Norio Kimura, Huey Ming Wang, Masayuki Kumekawa: Chemical mechanical polishing endpoint detection system and method. Ebara Technologies, Squire Sanders & Dempsey, Aaron Wininger, July 5, 2005: US06913514 (1 worldwide citation)

The system includes a polishing pad, a pad height sensor; a window; and a window raising mechanism. The polishing pad has an aperture with the window vertically moveable therein. The pad height sensor is positioned above the polishing pad and measures the vertical position of the pad before polishin ...



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