1
Akihiko Yamamoto, Yurimasa Zenitani, Masayoshi Yamaguchi: Propylene polymer compositions. Mitsui Petrochemical, Sherman and Shalloway, May 2, 1995: US05412020 (69 worldwide citation)

The propylene polymer composition of the invention comprises, as its essential components, a specific propylene polymer [A] described below and a propylene block copolymer [B]. In addition to the propylene polymer [A] and the propylene block copolymer [A], the propylene polymer composition may conta ...


2
Masayoshi Yamaguchi, Kazunori Meguro, Shuitsu Matsuo, Yasumi Sasaki: Alumina composite body and method for its manufacture. Toshiba Ceramics, Schwartz Jeffery Schwaab Mack Blumenthal & Evans, June 16, 1987: US04673435 (67 worldwide citation)

An alumina composite body comprising a plurality of elongated alumina elements oriented in random directions and interconnected so as to constitute a porous matrix, and aluminum and silicon tightly filling the porous matrix; and a method of manufacturing an alumina composite body comprising reacting ...


3
Masayoshi Yamaguchi, Mitsutoshi Sawano, Kazutoshi Hohki: Multi-chip module having printed wiring board comprising circuit pattern for IC chip. Kabushiki Kaisha Toshiba, Finnegan Henderson Farabow Garrett & Dunner L, November 14, 2000: US06147876 (55 worldwide citation)

Bare IC chips (201 through 203) are mounted on respective areas (101 through 103) of a printed wiring board (100). The outer electrode pads (105) on the peripheries of the board (100) are soldered to another printed wiring board (1) such as a mother board. Lead pads (107) and the outer electrode pad ...


4
Masayoshi Yamaguchi, Mitsutoshi Sawano, Kazutoshi Hohki: Multi-chip module. Kabushiki Kaisha Toshiba, Finnegan Henderson Farabow Garrett & Dunner L, July 9, 2002: US06418030 (55 worldwide citation)

A multi-chip module includes bare IC chips mounted on respective areas of a printed wiring board. Outer electrode pads on the peripheries of the board are soldered to another printed wiring board such as a motherboard. Lead pads and the outer electrode pads are interconnected through a circuit patte ...


5
Kenichi Morizono, Keiji Okada, Masayoshi Yamaguchi: Unsaturated copolymers, processes for preparing the same, and compositions containing the same. Mitsu Chemicals, October 30, 2001: US06310164 (32 worldwide citation)

Unsaturated copolymer which is a copolymer of an &agr;olefin of 2 to 12 carbon atoms and a conjugated diene monomer represented by the following formula (I-a) and has the properties: (a) in said copolymer, 1,2-addition units (including 3,4-addition units) derived from the conjugated diene monomer (I ...


6
Satoru Asagiri, Masayoshi Yamaguchi: Method of mounting electronic component. Kabushiki Kaisha Toshiba, Finnegan Henderson Farabow Garrett & Dunner L, November 13, 2001: US06315856 (28 worldwide citation)

In a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising a resin-based binder mixed with filler, the isotropic conductive adhesive is supplied to the electrodes on the print ...


7
Masayoshi Yamaguchi, Akio Ishimoto, Hiroshi Wakumoto, Masahiro Sugi: Polypropylene composition. Mitsui Petrochemical, Sherman and Shalloway, June 17, 1997: US05639829 (24 worldwide citation)

Disclosed are a polypropylene composition comprising 95-55 parts by weight of polypropylene (A) and 5-45 parts by weight of an ethylene/1-butene random copolymer (B-1) which contains constituent units derived from 1-butene in an amount of 15 to 25% by mol; and a polypropylene composition comprising ...


8
Masayoshi Yamaguchi, Akio Ishimoto, Hiroshi Wakumoto, Masahiro Sugi: Polypropylene composition. Mitsui Petrochemical, Sherman and Shalloway, June 17, 1997: US05639816 (22 worldwide citation)

Disclosed are a polypropylene composition comprising 95-55 parts by weight of polypropylene (A) and 5-45 parts by weight of an ethylene/1-butene random copolymer (B-1) which contains constituent units derived from 1-butene in an amount of 15 to 25% by mol; and a polypropylene composition comprising ...


9
Takashi Yamade, Seishi Watahiki, Yasuzi Sakuma, Masayoshi Yamaguchi, Shinichi Kurita: Method of and apparatus for conducting plasma welding. Hitachi, Antonelli Terry & Wands, April 17, 1990: US04918283 (21 worldwide citation)

A plasma welding method has successive steps including pre-heating of members to be welded, tack welding of the members for tentatively fixing these members, keyhole welding for completely welding the members to each other, and finish padding. These steps are automatically conducted by a single plas ...


10
Tomio Kashihara, Toshiro Tsuruta, Masayoshi Yamaguchi, Kiyotachi Yokoi, Etsuji Suzuki: Apparatus for conveying a lead frame mounting semiconductor pellets. Tokyo Shibaura Denki Kabushiki Kaisha, Cushman Darby & Cushman, May 14, 1985: US04516673 (19 worldwide citation)

An apparatus for conveying a lead frame mounting semiconductor pellets comprises a guide path for guiding the lead frame, and a feed member. The feed member is moved by a solenoid mechanism from a first position where the feed member is separated from the lead frame to a second position where the fe ...