1
Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda: Apparatus and method for chamfering wafer. Tokyo Seimitsu, David S Safran, Nixon Peabody, July 31, 2001: US06267648 (69 worldwide citation)

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.


2
Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda: Apparatus and method for chamfering wafer. Tokyo Seimitsu, David S Safran, Nixon Peabody, August 13, 2002: US06431961 (6 worldwide citation)

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.