1
Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe, Seiichi Orimo, Masanori Onodera, Masaki Waki: Method of producing a semicondutor device having a lead portion with outer connecting terminal. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, August 12, 1997: US05656550 (189 worldwide citation)

This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device has a semiconductor chip, a lead member having a lead portion and an outer connecting terminal connected integrally to the lead por ...


2
Katsuhiro Hayashida, Mitsutaka Sato, Tadashi Uno, Tetsuya Fujisawa, Masaki Waki: Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, May 9, 2000: US06060768 (131 worldwide citation)

A semiconductor device includes a semiconductor chip in which electrode pads are formed with a first pitch, leads electrically connected with the electrode pads through lines, and sealing plastic sealing the semiconductor chip. In the semiconductor device, projections used for external connection po ...


3
Masaki Waki, Junichi Kasai, Tsuyoshi Aoki, Toshiyuki Honda, Hirotaka Sato: Semiconductor device having a plurality of chips. Fujitsu, Staas & Halsey, October 31, 1995: US05463253 (128 worldwide citation)

A semiconductor device includes lead frames (21) respectively having first main surfaces and second main surfaces opposite to each other, bonding being able to be performed on the first and second main surfaces, a first semiconductor chip (22) arranged on first main surface sides of the lead frames, ...


4
Tetsuya Fujisawa, Mitsutaka Sato, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki, Masaki Waki, Toshio Hamano, Katsuhiro Hayashida, Yoshitsugu Katoh, Hiroshi Inoue: Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism. Fujitsu, Armstrong Westerman & Hattori, August 13, 2002: US06433418 (116 worldwide citation)

A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outsid ...


5
Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe, Seiichi Orimo, Masanori Onodera, Masaki Waki: Semiconductor device having a lead portion with outer connecting terminals. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, July 3, 2001: US06255740 (55 worldwide citation)

This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device has a semiconductor chip, a lead member having a lead portion and an outer connecting terminal connected integrally to the lead por ...


6
Masaki Waki, Junichi Kasai, Tsuyoshi Aoki, Toshiyuki Honda, Hirotaka Sato: Semiconductor device having a plurality of chips. Fujitsu, Staas & Halsey, June 25, 1996: US05530292 (48 worldwide citation)

Two semiconductor chips are coupled to outer leads by means of tape leads so that the chips are spaced apart from each other. A space between the chips is filled with a mold resin.


7
Masaki Waki, Tosiyuki Honda, Yukio Gomi: Semiconductor device having a plurality of semiconductor chips. Fujitsu, Kyushu Fujitsu Electronics, Staas & Halsey, December 26, 1995: US05479051 (24 worldwide citation)

A semiconductor device includes at least a first semiconductor chip and a second semiconductor chip each having a first surface and a second surface. The second surface of the first semiconductor chip confronts the first surface of the second semiconductor chip. Additionally, the semiconductor devic ...


8
Akira Takashima, Toshiyuki Honda, Masaki Waki: Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins. Fujitsu, Kyushu Fujitsu Electronics, Staas & Halsey, September 5, 1995: US05447888 (10 worldwide citation)

A process wherein the parts of a lead frame that are outside a cavity are directly supported by ejecting pins extending from above and from below when the lead frame is sandwiched between an upper die and a lower die. The ejecting pins eject the lead frame, on which a package is formed, after a resi ...


9
Masaki Waki, Katsuhiro Hayashida, Mitsutaka Sato, Tadashi Uno, Kazuhiko Mitobe, Tetsuya Fujisawa: Method of fabricating a semiconductor device. Fujitsu, Nikaido Marmelstein Murray & Oram, November 16, 1999: US05984699 (4 worldwide citation)

A lead frame is formed by subjecting a frame base to a forming process, a semiconductor chip is fixed on leads formed in the lead frame and wires are provided in the semiconductor chip, and then a package which accommodates the semiconductor chip is formed; a non-conductive adhesive being provided, ...


10
Masaki Waki: Semiconductor device having tab leads. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, December 23, 1997: US05701028 (2 worldwide citation)

A semiconductor device having a semiconductor chip and a TAB lead adhering to a surface of the semiconductor chip by a TAB tape which electrically connects an internal terminal arranged in a center part of a surface of the semiconductor chip to an external terminal arranged around a periphery of the ...