1
Masakatsu Ohta: Illumination device. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, January 29, 1991: US04988188 (86 worldwide citation)

An illumination device includes a light source; a secondary light source forming system for forming predetermined secondary light sources by use of light from the light source, the secondary light source forming system including a plurality of lens array units disposed in the direction of an optical ...


2
Masao Kosugi, Toshikazu Matsushita, Shuichi Yabu, Masakatsu Ohta: Projection exposure apparatus. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, November 22, 1988: US04786947 (63 worldwide citation)

A semiconductor device manufacturing projection exposure apparatus in which a pattern of a reticle is projected onto a semiconductor wafer through a projection optical system having a lens element and in which the reticle is irradiated with a light of a predetermined wavelength to thereby transfer t ...


3
Masakatsu Ohta, Hideki Ina, Akiyoshi Suzuki: Alignment and exposure apparatus. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, September 15, 1992: US05148214 (43 worldwide citation)

A mark detecting device usable in an alignment and exposure apparatus for aligning an alignment mark of a mask with an alignment mark of a wafer and for exposing a resist layer provided on the surface of the wafer to a pattern of the mask with radiation. The device includes a system for detecting li ...


4
Masakatsu Ohta: Illumination apparatus. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, July 28, 1987: US04683524 (25 worldwide citation)

An illumination apparatus for illuminating a surface, having formed thereon a pattern, to transfer the pattern onto a semiconductor wafer. The apparatus includes an elliptic mirror for forming an image of a light source, an imaging system for re-imaging the image of the light source, formed by the e ...


5
Masakatsu Ohta, Shuichi Yabu, Junichi Murakami: Projection apparatus. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, March 12, 1991: US04998821 (18 worldwide citation)

A projection apparatus for projecting through an optical system a circuit pattern formed on a mask or reticle onto a wafer. Ambient or environment conditions of the apparatus, such as an atmospheric pressure, temperature and humidity are detected and, on the basis of the results of detection, any fo ...


6
Masakatsu Ohta, Masaaki Itoi: Nozzle for melt spinning of pitch and method for spinning pitch. Idemitsu Kosan, Frishauf Holtz Goodman & Woodward, December 19, 1989: US04887957 (5 worldwide citation)

A nozzle for melt spinning of pitch to produce pitch fibers which are to be used in production of carbon fibers, includes a pitch flow section and a plurality of nozzle holes provided in the bottom of the nozzle. The pitch is passed through a pitch flow turning section, a pitch reservoir section, an ...


7
Masaaki Itoi, Masakatsu Ohta, Taizo Sugioka, Kunio Yoshihara, Hiroshi Nishitani: Pitch material for carbonaceous body and a method for the preparation thereof. Idemitsu Kosan Company, Frishauf Holtz Goodman & Woodward, August 26, 1986: US04608150 (4 worldwide citation)

The invention provides a novel pitch material useful as a base material of carbon fibers having excellent mechanical properties and characterized by a unique combination of several property parameters including the content of the optically anisotropic phase of at least 80%, a content of the pyridine ...


8
Nobuo Kawase, Masakatsu Ohta, Nobuyoshi Tanaka: Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method. Canon Kabushiki Kaisha, Morgan & Finnegan L, February 28, 2006: US07005081

This invention discloses an ingot cutting apparatus, wherein a crystalline ingot is positioned within an etching gas and a component of the etching gas is excited by illumination of light from a light source onto the crystalline ingot, thereby making a component of the etching gas react chemically w ...


9
Nobuo Kawase, Masakatsu Ohta, Nobuyoshi Tanaka: Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method. Morgan & Finnegan, January 30, 2003: US20030022508-A1

This invention discloses an ingot cutting apparatus, wherein a crystalline ingot is positioned within an etching gas and a component of the etching gas is excited by illumination of light from a light source onto the crystalline ingot, thereby making a component of the etching gas react chemically w ...


10
Nobuo Kawase, Masakatsu Ohta, Nobuyoshi Tanaka: Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method. Morgan & Finnegan, February 9, 2006: US20060027531-A1

This invention discloses an ingot cutting apparatus, wherein a crystalline ingot is positioned within an etching gas and a component of the etching gas is excited by illumination of light from a light source onto the crystalline ingot, thereby making a component of the etching gas react chemically w ...