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Masahisa Suzuki, Takashi Mimura: Method of producing enhancement mode and depletion mode FETs. Fujitsu, Armstrong Nikaido Marmelstein & Kubovcik, October 7, 1986: US04615102 (41 worldwide citation)

A semiconductor device, which comprises an E-mode FET and a D-mode FET and utilizes a two-dimensional electron gas, comprises a semi-insulating semiconductor substrate, a channel layer, an electron-supply layer, a third layer, a first etching-stoppable layer, a fifth layer, and a second etching-stop ...


2
Teruo Yokoyama, Masahisa Suzuki, Tomonori Ishikawa, Takeshi Igarashi: Semiconductor integrated circuit having a reduced side gate effect. Fujitsu, Staas & Halsey, January 4, 1994: US05276340 (12 worldwide citation)

A semiconductor integrated circuit including therein a plurality of active devices comprises a semiconductor substrate, a first buffer layer on the substrate, a second buffer layer provided on the substrate and incorporating therein defects with a concentration level substantially larger than the co ...


3
Masahisa Suzuki: Semiconductor device having overlapping conductor layers. Fujitsu, Nikaido Marmelstein Murray & Oram, October 12, 1993: US05252843 (9 worldwide citation)

A semiconductor device includes a semiconductor substrate, an active layer formed on the semiconductor substrate, source and drain electrodes respectively formed on the active layer, a gate electrode formed on the active layer between the source and drain electrodes and including a gate contact port ...


4
Satoshi Nagai, Tetuya Funaki, Masahisa Suzuki, Yasuhiro Ando, Shinya Miyamoto: Wiring harness arranging construction. Sumitomo Wiring Systems, Anthony J Casella, Gerald E Hespos, Michael J Porco, April 17, 2001: US06217375 (9 worldwide citation)

A wiring harness arranging construction is provided to arrange a wiring harness in a position more toward a passenger compartment than a hinge and a weatherstrip. The construction includes a container casing


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Masahisa Suzuki, Tetsuya Takimoto, Yasuhiro Ando, Tetuya Funaki, Shinichi Suehiro: Wiring harness arranging construction. Sumitomo Wiring Systems, Anthony J Casella, Gerald E Hespos, Michael J Porco, August 22, 2000: US06107570 (7 worldwide citation)

There is provided a guide frame 10 having a small width and a triangular or other shape. An insertion opening 10e and a withdrawal opening 10g for a wiring harness D.multidot.W/H are formed in spaced-apart positions of the guide frame 10. The wiring harness D.multidot.W/H is fixedly inserted through ...


6
Masahisa Suzuki, Tetsuya Takimoto, Yasuhiro Ando, Tetuya Funaki, Shinichi Suehiro: Wiring harness arranging construction. Sumitomo Wiring Systems, Anthony J Casella, Gerald E Hespos, November 30, 1999: US05994645 (7 worldwide citation)

There is provided a guide frame 10 having a small width and a triangular or other shape. An insertion opening 10e and a withdrawal opening 10g for a wiring harness DW/H are formed in spaced-apart positions of the guide frame 10. The wiring harness DW/H is fixedly inserted through the insertion openi ...


7
Masahisa Suzuki, Tetsuya Takimoto, Yasuhiro Ando, Tetuya Funaki, Shinichi Suehiro: Wiring harness arranging construction. Sumitomo Wiring Systems, Anthony J Casella, Gerald E Hespos, Michael J Porco, June 27, 2000: US06079764 (5 worldwide citation)

A guide member 10 made of an elastic material has an arcuate portion 10a which extends and contracts while twisting. A wiring harness D.multidot.W/H is arranged between a door and a body of a vehicle after being mounted on the guide member 10, and the opposite ends of the guide member 10 are fixed t ...


8
Satoshi Nagai, Tetuya Funaki, Masahisa Suzuki, Yasuhiro Ando, Shinya Miyamoto: Wiring harness arranging construction. Sumitomo Wiring Systems, Anthony J Casella, Gerald E Hespos, Ludomir A Bodzyn, September 28, 1999: US05957702 (4 worldwide citation)

A wiring harness arranging construction is provided to arrange a wiring harness in a position more toward a passenger compartment than a hinge and a weatherstrip. The construction includes a container casing 10 with a space 10p for accommodating a looped harness, an insertion opening 10f and a withd ...


9
Masahisa Suzuki: Semiconductor device having overlapping conductor layers and method of producing the semiconductor device. Fujitsu, Nikaido Marmelstein Murray & Oram, October 25, 1994: US05358900

A semiconductor device includes a semiconductor substrate, an active layer formed on the semiconductor substrate, source and drain electrodes respectively formed on the active layer, a gate electrode formed on the active layer between the source and drain electrodes and including a gate contact port ...


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