1
Kazuyuki Imamura, Yasunori Fujimoto, Masaaki Seki, Tetsuya Fujisawa, Mitsutaka Sato, Ryuji Nomoto, Junichi Kasai, Yoshitaka Aiba, Noriaki Shiba: Semiconductor device having columnar electrode and method of manufacturing same. Fujitsu, Armstrong Westerman & Hattori, November 5, 2002: US06476503 (124 worldwide citation)

A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. So ...


2
Tetsuya Fujisawa, Mitsutaka Sato, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki, Masaki Waki, Toshio Hamano, Katsuhiro Hayashida, Yoshitsugu Katoh, Hiroshi Inoue: Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism. Fujitsu, Armstrong Westerman & Hattori, August 13, 2002: US06433418 (116 worldwide citation)

A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outsid ...


3
Yoshitsugu Katoh, Mitsutaka Sato, Hiroshi Inoue, Seiichi Orimo, Akira Okada, Yoshihiro Kubota, Mitsuo Abe, Toshio Hamano, Yoshitaka Aiba, Tetsuya Fujisawa, Masaaki Seki, Noriaki Shiba: Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, December 25, 2001: US06333564 (31 worldwide citation)

A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chi ...


4
Masaaki Seki, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Lim Cheang Hai, Koki Otake, Susumu Abe, Junichi Kasai, Masao Sakuma, Yoshimi Suzuki, Yasuhiro Shinma: Semiconductor device, base member for semiconductor device and semiconductor device unit. Fujitsu, Fujitsu Automation, Nikaido Marmelstein Murray & Oram, May 5, 1998: US05747874 (18 worldwide citation)

A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor ...


5
Yukio Takigawa, Shigeaki Yagi, Toshimi Kawahara, Mitsunada Osawa, Hiroyuki Ishiguro, Shinya Nakaseko, Takashi Hozumi, Masaaki Seki: Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition. Fujitsu, Nikaido Marmelstein Murray & Oram, December 1, 1998: US05844309 (15 worldwide citation)

An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or ...


6
Masaaki Seki, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Lim Cheang Hai, Koki Otake, Susumu Abe, Junichi Kasai, Masao Sakuma, Yoshimi Suzuki, Yasuhiro Shinma: Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit. Fujitsu, Fujitsu Automation, Nikaido Marmelstein Murray & Oram, February 8, 2000: US06022759 (14 worldwide citation)

A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor ...


7
Masaaki Seki, Katsuhiro Hayashida, Mitsutaka Sato, Toshio Hamano: Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure. Fujitsu, Staas & Halsey, October 8, 2002: US06462424 (12 worldwide citation)

A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing ...


8
Tetsuya Fujisawa, Mitsutaka Sato, Kazuhiko Mitobe, Katsuhiro Hayashida, Masaaki Seki, Seiichi Orimo, Toshio Hamano: Semiconductor device and semiconductor device module. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, July 25, 2000: US06094356 (9 worldwide citation)

A semiconductor device including a semiconductor chip, connection parts arranged along one end of the semiconductor chip, and external connection terminals connected to the connection parts.


9
Masaaki Seki, Katsuhiro Hayashida, Mitsutaka Sato, Toshio Hamano: Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure. Fujitsu, Stass & Halsey, December 26, 2000: US06165819 (8 worldwide citation)

A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing ...


10
Masaaki Seki, Masato Suzuki, Ryoichi Owada: Aerosol housing mechanism and aerosol-type product having the aerosol housing mechanism. MITANI VALVE, DAIZO CORPORATION, Lucas & Mercanti, July 24, 2018: US10029844

An expanded housing (2) including an outer tubular portion (2a), a center-top tubular portion (2b), an annular ceiling portion (2c), and a center-bottom tubular portion (2d) is an integrally molded plastic product. Vertical plate rib-shaped portions (2h) for increasing strength are similarly integra ...