1
Timothy Leung, Mary Jean Bajacan Ramos, Gan Kian Yeow, Kyaw Ko Lwin, Romarico Santos San Antonio, Anang Subagio: Method of making thermally enhanced substrate-base package. Unisem, Wiggin and Dana, June 22, 2010: US07741158 (55 worldwide citation)

An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a ...


2
Romarico Santos San Antonio, Anang Subagio, Glenn Macaraeg, Mary Jean Bajacan Ramos: Method of making flip-chip package with underfill. Unisem, Wiggin and Dana, April 20, 2010: US07700414 (10 worldwide citation)

A method for the manufacture of a package to encapsulate at least one integrated circuit device includes the steps of: (1) providing a dielectric substrate having a first plurality of bond pads formed on a first side thereof and at least one aperture; (2) electrically interconnecting the integrated ...


3
Mary Jean Bajacan Ramos, Romarico Santos San Antonio, Anang Subagio: No lead package with heat spreader. Unisem, Wiggin and Dana, September 20, 2011: US08022512 (1 worldwide citation)

A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and ...


4
Mary Jean Bajacan Ramos, Romarico Santos San Antonio, Anang Subagio: No lead package with heat spreader. Wiggin And Dana, August 30, 2007: US20070200207-A1

A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and ...


5
Timothy Leung, Mary Jean Bajacan Ramos, Gan Kian Yeow, Kyaw Ko Lwin, Romarico Santos San Antonio, Anang Subagio: Method of making thermally enhanced substrate-base package. Advanced Interconnect Technologies a Corporation of Mauritius, Wiggin And Dana, December 13, 2007: US20070284733-A1

An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a ...


6
Mary Jean Bajacan Ramos, Romarico Santos San Antonio, Anang Subagio: No lead package with heat spreader. December 15, 2011: US20110304032-A1

A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and ...