1
Maruyama Shunsuke, Abe Hideji, Itonaga Soichiro, Ohashi Masanori, Yamamoto Atsuhiko, Taya Keiji: Semiconductor device and manufacturing method thereof, and solid-state image pickup element and manufacturing method thereof. Sony, August 17, 2006: JP2006-216616 (8 worldwide citation)

PROBLEM TO BE SOLVED: To provide a semiconductor device containing a solid-state image pickup element for forming a mask on a region exceeding the limit of mask fining, reducing the number of processes, and improving reliability, and also to provide a method for manufacturing the semiconductor devic ...


2
Maruyama Shunsuke: Solid-state imaging apparatus, method of producing the same, camera, and electronic apparatus. Sony, July 23, 2009: JP2009-164247 (6 worldwide citation)

PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus that is reduced in the fluctuation of the sensitivity, by reducing the level difference in the boundary region between an effective pixel region and a peripheral region, and to provide a method of producing the same apparatus and also ...


3
Maruyama Shunsuke, Fujimagari Junichiro, Wakano Hisashi, Torii Motonobu, Hoshi Hironori, Kikuchi Koji: Solid state imaging device. Sony, August 9, 2007: JP2007-201269 (5 worldwide citation)

PROBLEM TO BE SOLVED: To aim at an area expansion of a photoelectric conversion section by avoiding hindrance of condensing to the photoelectric conversion section by an interconnection in a CMOS image sensor of slanting pixel staggering arrangement.SOLUTION: A pixel 24 which consists of the photoel ...


4
Maruyama Shunsuke, Abe Hideji, Ohashi Masanori, Taya Keiji: Solid-state image pickup device and its manufacturing method. Sony, October 26, 2006: JP2006-294991 (3 worldwide citation)

PROBLEM TO BE SOLVED: To provide a solid-state image pickup device capable of eliminating a step between a light-sensitive pixel region and a black level reference pixel part, and to provide its manufacturing method.SOLUTION: Multilayer wiring 24 is formed on a semiconductor substrate 21 including t ...


5
Maruyama Shunsuke: Solid-state image pickup device and its manufacturing method. Sony, September 11, 2008: JP2008-210975 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a solid-state image pickup device having a high waveguide effect and capable of easily forming the waveguide, and to provide its manufacturing method.SOLUTION: The solid-state image pickup device comprises a plurality of pixels 50; a multilayer interconnection layer ...


6
Itonaga Soichiro, Maruyama Shunsuke: Method of manufacturing of solid-state imaging device, solid-state imaging device and camera. Sony, April 5, 2007: JP2007-088306 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid-state imaging device capable of enlarging the dimension of an in-layer lens by forming the lens in self align for the base, and to provide the solid-state imaging device and a camera.SOLUTION: The manufacturing method of a solid-stat ...


7
Maruyama Shunsuke, Abe Hideji, Ohashi Masanori, Kurebayashi Hisashi, Taya Keiji, Fujimagari Junichiro, Enomoto Yasuyuki: Solid state imaging device and its manufacturing method. Sony, July 19, 2007: JP2007-184311 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a solid state imaging device in which a sufficient light-blocking effect is attained in a black reference pixel without increasing the number of manufacturing steps, and to provide its manufacturing method.SOLUTION: In the solid state imaging device having a wiring l ...


8
Maruyama Shunsuke, Sato Takashi: Control method of rubber kneader. Yokohama Rubber The, February 24, 2005: JP2005-047094 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a control method of a rubber kneader capable of kneading a rubber so as to always adjust the same to a proper viscosity regardless of the temperature of the rubber kneader at the beginning of kneading.SOLUTION: This control method of the rubber kneader is equipped wi ...


9
Maruyama Shunsuke: Solid state imaging device. Sony, March 23, 2006: JP2006-080252 (1 worldwide citation)

PROBLEM TO BE SOLVED: To solve the problem of degradation in condensing efficiency and color mixture that accompany the laminating structure of an optical filter, and to improve precision in black reference due to light shielding pixel.SOLUTION: Relating to a CMOS image sensor, an embedded color fil ...


10
Maruyama Shunsuke, Hori Satoru, Inuzuka Shinobu, Maeda Atsushi: Heat treatment furnace. Daido Steel, October 5, 2006: JP2006-266616 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a heat treatment furnace capable of uniformizing the temperature of treated objects when cooled even when the internal temperature of the heat treatment chamber is high, and requiring only a small space in the heat treatment chamber.SOLUTION: The heat treatment furna ...