1
Michael Bauer, Peter Strobel, Gerald Ofner, Edward F├╝rgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig Czaja PLLC, September 2, 2008: US07420262 (20 worldwide citation)

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...


2
Uwe Luckner, Georg Ernst, Manuel Carmona, Markus Fink: Heat sink for surface-mounted semiconductor devices. Infineon Technologies, Edell Shapiro & Finnan, June 12, 2007: US07230831 (9 worldwide citation)

A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on ...


3
Markus Brunnbauer, Markus Fink, Hans Gerd Jetten: Semiconductor module having a semiconductor chip stack and method. Infineon Technologies, Dicke Billig & Czaja PLLC, January 31, 2012: US08106497 (5 worldwide citation)

A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropically thermally conductive particl ...


4
Edward Fuergut, Markus Fink: Method for fabricating a semiconductor chip panel. Infineon Technologies, Slater & Matsil L, April 3, 2012: US08148210 (1 worldwide citation)

The method includes providing a plurality of semiconductor chips and placing the plurality of semiconductor chips on a carrier. A compression molding apparatus is provided that includes a first tool and a second tool. The carrier is placed on the first tool of the compression molding apparatus and t ...


5
Markus Brunnbauer, Markus Fink, Hans Gerd Jetten: Semiconductor module having a semiconductor chip stack and method. Infineon Technologies, Dicke Billig & Czaja PLLC, November 19, 2013: US08587110

A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropically thermally conductive particl ...


6
Michael Bauer, Thomas Bemmerl, Markus Fink, Edward Fuergut, Horst Groeninger, Hermann Vilsmeier: Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof. Infineon Technologies, Dicke Billig & Czaja PLLC, May 4, 2010: US07709379

An electrical device having carbonized conductors and a method and a device for the production thereof is disclosed. The electrical device has electrical components having connections. Furthermore, there are situated between the electrical components regions made of plastic with conductors having ca ...


7
Michael Bauer, Peter Strobel, Gerald Ofner, Edward Furgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig & Czaja PLLC, October 21, 2004: US20040207049-A1

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...


8
Markus Brunnbauer, Markus Fink, Hans Gerd Jetten: Semiconductor module having a semiconductor chip stack and method. Infineon Technologies, Dicke Billig & Czaja, August 2, 2007: US20070176277-A1

A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropically thermally conductive particl ...


9
Uwe Luckner, Georg Ernst, Manuel Carmona, Markus Fink: Heat sink for surface-mounted semiconductor devices. Edell Shapiro & Finnan, July 20, 2006: US20060158857-A1

A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on ...


10
Edward Fuergut, Markus Fink: Method for fabricating a semiconductor chip panel. March 15, 2012: US20120064673-A1

The method includes providing a plurality of semiconductor chips and placing the plurality of semiconductor chips on a carrier. A compression molding apparatus is provided that includes a first tool and a second tool. The carrier is placed on the first tool of the compression molding apparatus and t ...



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