1
Alexei Glebov, Mark McCormack: Interposer and method for producing a light-guiding structure. Fujitsu, Sheppard Mullin Richter & Hampton, August 5, 2003: US06603915 (112 worldwide citation)

An interposer and method for producing an interposer. The method comprises forming in a substrate a cladding layer having a known density value; and forming in the substrate a waveguide core layer in contact with the cladding layer and also having a known density value which is greater than the dens ...


2
Francesco Carobolante, Ermanno Pace, Mark McCormack: Brushless direct current motor starting and operating apparatus and method. SGS Thomson Microelectronics, Ronald S Lombard, Richard K Robinson, May 21, 1991: US05017845 (65 worldwide citation)

A starting and operating apparatus and method for a sensorless, brushless direct current motor is disclosed. During start-up, the excitation to the motor is turned off while the slope of the differential back electromotive force of the floating phases is sampled. This indicates when the proper rotat ...


3
Hunt Hang Jiang, Yasuhito Takahashi, Michael Guang Tzong Lee, Wen chou Vincent Wang, Mark McCormack: Multilayer circuit structure build up method. Fujitsu, Coudert Brothers, August 6, 2002: US06428942 (17 worldwide citation)

Methods for forming multilayer circuit structures are disclosed. In some embodiments, conductive layers, dielectric layers and conductive posts can be formed on both sides of a circuitized core structure. The conductive posts are disposed in the dielectric layers and can be stacked to form a general ...


4
Alex Glebov, Mark Mccormack: Method for manufacturing interposer and light-guiding structure. Fujitsu, October 31, 2002: JP2002-318317 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a method for manufacturing an interposer which is unaffected by the capacitive load and the resistivity of a transmission line and to provide a method for manufacturing a light guiding structure.SOLUTION: The interposer 14 is formed in a way that a clad layer 28 havi ...


5
Alexei Glebov, Mark McCormack: Interposer and method for producing a light-guiding structure. Coudert Brothers, June 5, 2003: US20030103712-A1

An interposer and method for producing an interposer. The method comprises forming in a substrate a cladding layer having a known density value; and forming in the substrate a waveguide core layer in contact with the cladding layer and also having a known density value which is greater than the dens ...


6
Hunt Hang Jiang, Mark McCormack, Albert W Chan, Kuo Chuan Liu: Structure and method for forming z-laminated multilayered packaging substrate. Coudert Brothers, August 29, 2002: US20020119396-A1

A method for forming a plurality of solder bumps comprising providing a pair of metallic supports. An initial solder layer is respectively disposed on each of the metallic supports which may be a metal-filled blind via. One or two additional solder layers are disposed on one of the initial solder la ...


7
Hunt Hang Jiang, Mark McCormack, Lei Zhang: Structure and method for depositing solder bumps on a wafer. Coudert Brothers, October 17, 2002: US20020151164-A1

A method for depositing solder bumps on a circuit substrate. The method comprises forming a dielectric layer on the circuit substrate which includes a plurality of conductive regions. The dielectric layer is patterned and opened to expose the conductive regions. A solder bump is disposed on each of ...