1
James E O Toole, John R Tuttle, Mark E Tuttle, Tyler Lowrey, Kevin M Devereaux, George E Pax, Brian P Higgins, David K Ovard, Shu Sun Yu, Robert R Rotzoll: Radio frequency data communications device. Micron Technology, Wells St John Roberts Gregory & Matkin P S, October 10, 2000: US06130602 (292 worldwide citation)

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receive ...


2
Mark E Tuttle, Trung T Doan, Angus C Fox, Gurtej S Sandhu, Hugh E Stroupe: Method and apparatus for improving planarity of chemical-mechanical planarization operations. Micron Technology, Fox III Angus C, August 3, 1993: US05232875 (233 worldwide citation)

A method and apparatus for improving planarity of chemical mechanical planarization of semiconductor wafers. The wafer is affixed to the planar surface of a wafer carrier. A planar platen, on which is mounted a polishing pad, is moved about in a plane parallel to the pad surface with either an orbit ...


3
Trung T Doan, Mark E Tuttle: Method to form a low resistant bond pad interconnect. Micron Semiconductor, David J Paul, January 24, 1995: US05384284 (209 worldwide citation)

The present invention develops a bond pad interconnect in an integrated circuit device, by forming an aluminum pad; bonding a metal layer (such as copper (Cu), nickel (Ni), tungsten (W), gold (Au), silver (Ag) or platinum (Pt)) or a metal alloy (such as titanium nitride) to the aluminum bond pad by ...


4
Mark E Tuttle, John R Tuttle: System with chip to chip communication. Micron Technology, Stanley N Protigal, William R Bachand, Robert J Stern, April 15, 1997: US05621913 (200 worldwide citation)

A system for wireless communication between a plurality of semiconductor chips is disclosed. Each data line in the present invention is coupled with a transmitter for transmitting information to any other semiconductor chip. Furthermore, each data line is coupled with a receiver for receiving inform ...


5
Mark E Tuttle, Rickie C Lake, Curtis M Medlen: Method of manufacturing and testing an electronic device, and an electronic device. Micron Technology, Wells St John Roberts Gregory & Matkin P S, January 2, 2001: US06167614 (183 worldwide citation)

A method of manufacturing and testing an electronic circuit, the method comprising forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces; attaching a circuit component to the substrate and coupling the circuit component to at least one of the con ...


6
Mark E Tuttle: Wireless identification device, RFID device, and method of manufacturing wireless identification device. Micron Technology, Wells St John Roberts Gregory & Matkin P S, March 14, 2000: US06037879 (171 worldwide citation)

A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and permitting operation of the circuitry only while the switch is a ...


7
Mark E Tuttle: Polishing pad with uniform abrasion. Micron Technology, Stanley N Protigal, Angus C Fox III, June 4, 1991: US05020283 (163 worldwide citation)

A polishing pad for semiconductor wafers, having a face shaped by a series of voids. The voids are substantially the same size, but the frequency of the voids increases with increasing radial distance to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconduc ...


8
Mark E Tuttle, Rickie C Lake, Joe P Mousseau, Clay L Cirino: Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant. Micron Communications, Stephen A Gratton, May 25, 1999: US05907477 (154 worldwide citation)

An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. Dur ...


9
Mark E Tuttle, John R Tuttle, Rickie C Lake: Method of manufacturing an enclosed transceiver. Micron Communications, William R Bachand, Robert J Stern, July 14, 1998: US05779839 (153 worldwide citation)

The present invention teaches a method of manufacturing a enclosed transceiver, such as a radio frequency identification ("RFID") tag. Structurally, in one embodiment, the tag comprises an integrated circuit (IC) chip, and an RF antenna mounted on a thin film substrate powered by a thin film battery ...


10
Mark E Tuttle: Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device. Micron Technology, Wells St John P S, February 17, 2004: US06693513 (146 worldwide citation)

A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A metho ...