1
Ari Glezer, Mark G Allen, David J Coe, Barton L Smith, Mark A Trautman, John W Wiltse: Synthetic jet actuator and applications thereof. Georgia Tech Research Corporation, Thomas Kayden Horstemeyer & Risley, June 2, 1998: US05758823 (111 worldwide citation)

Synthetic jet actuator, which can be micromachined if desired, generates a synthetic jet stream characterized by a series of successive vortices that can be used for effectively entraining adjacent fluid. The synthetic jet actuator can be used to bend, or vector, a jet stream from another jet actuat ...


2
Ari Glezer, Mark G Allen, David J Coe, Barton L Smith, Mark A Trautman, John W Wiltse: Synthetic jet actuator and applications thereof. Georgia Tech Research Corporation, Thomas Kayden Horstemeyer & Risley L, April 20, 1999: US05894990 (58 worldwide citation)

A synthetic jet actuator, which can be micromachined if desired, generates a synthetic jet stream characterized by a series of successive vortices that can be used for effectively entraining adjacent fluid. The synthetic jet actuator can be used to bend, or vector, a jet stream from another jet actu ...


3
Ari Glezer, Barton L Smith, Mark A Trautman: Modifications of fluid flow about bodies and surfaces with synthetic jet actuators. Georgia Tech Research Corporation, Thomas Kayden Horstemeyer & Risley, September 28, 1999: US05957413 (55 worldwide citation)

The present invention involves a system for altering the aerodynamic shape and/or fluid flow field about a solid body. The preferred embodiment comprises a synthetic jet actuator embedded in a solid body, with the jet orifice built into the body surface. The synthetic jet actuator generates a series ...


4
Paul J Gwin, Rolf A Konstad, Peter A Davison, Mark A Trautman: Sealed and pressurized liquid cooling system for microprocessor. Intel Corporation, Buckley Maschoff & Talwalkar, October 26, 2004: US06809928 (26 worldwide citation)

According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchange ...


5
Paul B Koeneman, Mark A Trautman: Method and apparatus for cooling an integrated circuit package using a cooling fluid. Intel Corporation, Glen B Choi, April 25, 2006: US07032392 (23 worldwide citation)

A method and apparatus for cooling an integrated circuit die. An integrated circuit package comprises an integrated circuit die. A cooling fluid makes contact with the integrated circuit die. In one embodiment, an interposer is disposed between the integrated circuit die and a package substrate. The ...


6
Mark A Trautman, Paul B Koeneman: Thermal performance enhancement of heat sinks using active surface features for boundary layer manipulations. Intel Corporation, Blakely Sokoloff Taylor & Zafman, September 30, 2003: US06628522 (21 worldwide citation)

Cilia-like micro surface actuators are applied to fins of a heat sink to improve heat dissipation. The surface actuators act as active surface features whose motion disrupts the boundary layer fluid flow by entraining cool fluid towards the heat transfer surfaces of the fins and ejecting relatively ...


7
Rajiv K Mongia, Stephen W Montgomery, Willem M Beltman, Mark A Trautman, Nels E Jewell Larsen: Cooling apparatus and method. Intel Corporation, Schwabe Williamson & Wyatt P C, September 11, 2007: US07269008 (12 worldwide citation)

A cooling apparatus is provided with an electrostatic flow modifier to be complementarily positioned relative to a cooling fluid flow to modify at least one characteristic of the cooling fluid flow to enhance an amount of heat the cooling fluid flow removes from an electronic component.


8
Mark A Trautman, Muralidhar Tirumala: Method, system, and apparatus for dynamically distributing a computational load between clusters of cores at a frequency greater than a thermal time constant. Intel Corporation, International IP Law Group P L L C, November 20, 2012: US08316250 (7 worldwide citation)

A method, apparatus, article of manufacture, and system, the method including, in some embodiments, processing a computational load by a first core of a multi-core processor, and dynamically distributing at least a portion of the computational load to a second core of the multi-core processor to red ...


9
Steve J Lofland, Mark A Trautman: Cold plate. Intel Corporation, Rob Anderson of Intel Corporation, January 8, 2008: US07316263 (7 worldwide citation)

A novel cold plate may include one or more of the following features: relatively narrow channel gaps, two or more flow paths, primarily non-linear flow paths, and/or tapered channel walls.


10
Mark A Trautman, George Daskalakis: Low noise heatsink. Intel Corporation, Paul E Steiner, February 21, 2006: US07002795 (4 worldwide citation)

A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.