1
Patrick A Van Cleemput, George D Papasouliotis, Mark A Logan, Bart van Schravendijk, William J King: Very high aspect ratio gapfill using HDP. Novellus Systems, Tom Chen, Skjerven Morrill MacPherson, May 28, 2002: US06395150 (218 worldwide citation)

A process for filling high aspect ratio gaps on substrates uses conventional high density plasma deposition processes, with an efficient sputtering inert gas, such as Ar, replaced or reduced with an He inefficient sputtering inert gas such as He. By reducing the sputtering component, sidewall deposi ...


2
Joseph R Monkowski, Mark A Logan: Chemical vapor deposition reactor and method of use thereof. Lam Research Corporation, Townsend and Townsend, December 11, 1990: US04976996 (119 worldwide citation)

A chemical vapor deposition (CVD) recstor is described which comprises an annular reaction zone with means for one or more reactive gases to be passed in single pass radial flow in which there is little lateral diffusion, means for preventing recirculation of reactive gases or reaction products from ...


3
Justice Carman, Mark A Logan, Joseph Monkowski: CVD platen heater system utilizing concentric electric heating elements. Lam Research Corporation, James P Hillman, March 15, 1994: US05294778 (70 worldwide citation)

A wafer support platen heating system for low pressure chemical vapor deposition of apparatus includes multiple resistance heaters for individual heating of multiple portions of the platen to provide a predetermined uniform or non-uniform temperature gradient/profile across the platen. The multiple ...


4
Joseph R Monkowski, Mark A Logan, Lloyd F Wright: Simultaneous glass deposition and viscoelastic flow process. Lam Research Corporation, Blakely Sokoloff Taylor & Zafman, April 14, 1992: US05104482 (43 worldwide citation)

A glass deposition viscoelastic flow process for forming planar and semi-planar insulator structures on semiconductor devices, which comprises feeding vaporized reactants into a reaction chamber at a reaction temperature between 750.degree.-950.degree. C. and subjecting the surface of the semiconduc ...


5
Lloyd F Wright, Mark A Logan: Simulated tornado humidifier. Amazing Things, Townsend and Townsend Khourie and Crew, June 21, 1994: US05322646 (17 worldwide citation)

A system for humidifying air while generating a tornado-like air flow pattern highlighted by water aerosol is described. The system includes air flow devices which generate a circular tornado-like air flow, a water aerosol generator, and a means of injecting the water aerosol into the circular air p ...


6
Mark A Logan, Lloyd F Wright: Compact volatile organic compound removal system. Solid State Cooling Systems, Gary T Aka, August 6, 2002: US06427449 (16 worldwide citation)

A compact, volatile organic compound removal system is presented. The system has a metal condensation plate and a cooling source in intimate thermal contact with the metal condensation plate. The metal condensation plate has a channel formed in the plate, an inlet in the condensation plate for intro ...


7
David J Scott, Ben F Brian, Lloyd F Wright, Leo A Chin, Edward W Hollmen, Daniel W Seegars, Mark A Logan: Apparatus and method for providing enhanced heat transfer from a body. Zoll Circulation, John K Fitzgerald, Fulwider Patton, October 5, 2010: US07806915 (13 worldwide citation)

Methods and apparatuses for temperature modification of a patient, or selected regions thereof, including an induced state of hypothermia. The temperature modification is accomplished using an in-dwelling heat exchange catheter within which a fluid heat exchange medium circulates. A heat exchange ca ...


8
Lloyd F Wright, Justice N Carman, Mark A Logan: Thermoelectric cooling/heating system for high purity or corrosive liquids. Solid State Cooling Systems, Townsend and Townsend and Crew, May 4, 1999: US05899077 (12 worldwide citation)

A novel thermoelectric liquid heat exchange device for corrosive or high purity liquids is provided for. The heat exchange device has an array thermoelectric modules, with first and second heat exchanger plates arranged so as to sandwich the thermoelectric modules between the heat exchanger plates. ...


9
Joseph R Monkowski, Mark A Logan: Chemical vapor deposition method. LAM Research Corporation, Townsend and Townsend, February 25, 1992: US05091219 (10 worldwide citation)

A CVD process for the deposition of at least one layer of material on a wafer substrate is disclosed, which comprises the steps of : (a) positioning at least one wafer substrate horizontally within a generally circular wafer deposition zone; (b) passing a reactive gas radially through the zone and a ...


10
Gregory C Hoffman, Mark A Logan, Justice N Carman: Semiconductor dopant vaporizer. Air Products and Chemicals, James C Simmons, William F Marsh, July 4, 1989: US04845366 (4 worldwide citation)

The present invention involves apparatus and methods for introducing ion source material into an ion implant system for use in connection with Freeman type sources. A vaporizer unit which is removable from the system is prepared for insertion into the ion implant equipment outside the system. It is ...