1
Chen Sung Lin, Kuo Shih Kang, Lin Ken Huang: Radio frequency identification tag device. China Steel, May 21, 2009: JP2009-111986 (37 worldwide citation)

PROBLEM TO BE SOLVED: To provide a radio frequency identification tag device that is suitable for metallic products and that can extend a communication distance.SOLUTION: A radio frequency identification tag device includes an antenna unit 1, including a substrate 11 that has a first surface 111, a ...


2
Chen Sung Lin, Kuo Shih Kang, Lin Ken Huang: Radio frequency identification tag device for metallic products. China Steel, May 6, 2009: EP2056239-A1 (5 worldwide citation)

A radio frequency identification tag device includes an antenna unit (1) including a dielectric substrate (11) that has two through holes (113) extending from a first surface (111) to a second surface (112) opposite to the first surface (111), a first conductive layer (12) disposed over the first su ...


3

4
Wu Chun Yih, Yeh Shih Huang, Lin Ken Huang, Su Hsin Lung, Lo Chih Yung: Antenna apparatus and antenna radome and design method thereof. Industrial Technology Research Institute, renmo wen, December 31, 2008: CN200710197113

The invention relates to an antenna apparatus and antenna radome and design method thereof. The antenna radome is associated with an antenna and comprises a plurality of radome elements arranged in an array. Each radome element comprises a dielectric substrate on which an upper surface is provided w ...


5
Huang Yu Tung, Lin Ken Huang, Chang Ming Hung: Integrated and monolithic packing structure of surface acoustic wave device. Tai Saw Technology, December 11, 2005: TWI245383

An integrated and monolithic packing structure of acoustic wave device is provided that comprises a first device, a bonded layer, a second device and a conductive layer. The first device is placed in a way of face up, the second device is placed in a way of face down, and the bonded layer is placed ...


6
Huang Yu Tung, Lin Ken Huang: Surface acoustic wave element using the structure and method of connecting the conductive layer back to back. Tai Saw Technology, October 11, 2003: TW557591

The present invention provides a structure and a method for connecting surface acoustic wave elements back to back. The feature of which is connecting one surface acoustic wave element, on the back of which, is an evaporated conductive layer, with the back of another surface acoustic wave element, w ...


7

8

9

10