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Shyam Venkataraman
Raman Vijay Immanuel, Li Yuzhuo, Schade Christian, Venkataraman Shyam Sundar, Yu Shen Eason Su, Usman Ibrahim Sheik Ansar: [fr] COMPOSITION CHIMIQUE DE POLISSAGE MÉCANIQUE COMPRENANT DE LACIDE DE POLYVINYLE PHOSPHONIQUE ET SES DÉRIVÉS, [en] CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING POLYVINYL PHOSPHONIC ACID AND ITS DERIVATIVES. Raman Vijay Immanuel, Li Yuzhuo, Schade Christian, Venkataraman Shyam Sundar, Yu Shen Eason Su, Usman Ibrahim Sheik Ansar, BASF SE, BASF, June 27, 2013: WO/2013/093557 (2 worldwide citation)

[en] A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(=O)(OR1)(OR2) ) or phosp ...


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Shyam Venkataraman
Lauter Michael, Raman Vijay Immanuel, Li Yuzhuo, Venkataraman Shyam Sundar, Shen Daniel Kwo hung: A chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particles. BASF SE, liu jinhui lin bainan, July 18, 2012: CN201080050637

A chemical mechanical polishing (CMP) composition, comprising (A) at least one type of inorganic particles which are dispersed in the liquid medium (C), (B) at least one type of polymer particles which are dispersed in the liquid medium (C), (C) a liquid medium, wherein the zeta-potential of the ino ...


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