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Zhao Yongqing, Liu Anhong, Huang Xiangming, Li Yizhang, Li Yaorong: Image sensor module package structure. Chipmos Technologies, shouning zhanghua hui, April 25, 2007: CN200510114333

The invention relates to an image sensor mould package structure. Wherein, dual connecting pads are on the first surface of said glass base plate and outside the incident area of base plate; one wire layer is on the second surface of said glass base plate to be electrically connected to the connecti ...


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Liu Anhong, Wang Yonghe, Zhao Yongqing, Li Yaorong: Crystal wafer testing method and structure of led. Nanmao Science &Amp Technology, shouning zhanghua hui, May 2, 2007: CN200510114523

A method for testing grade of chip on LED includes sticking an adhesive tape at back said chip, cutting it to be multiple LED chip with adhesive tape, contacting P type and N type of electrodes on those chips by detection card with multiple detection structures in ohm mode, setting a light detector ...


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Huang Mingliang, Li Yaorong, Li Mingxun: Thin membrane encapsulation structure of fingerprint identifying device. Chipmos Technologies, shouning zhanghua hui, July 23, 2008: CN200710000953

The invention relates to a film packaging structure of a fingerprint identifier, which substantially comprises a wafer of the fingerprint identifier, a plurality of projections, a circuit film with a plurality of pins and at least a colloid which is used to seal the projections. A sensing area is fo ...


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Huang Mingliang, Li Yaorong, Li Mingxun: Thin membrane encapsulation structure of fingerprint identifying device. Chipmos Technologies, shouning zhanghua hui, July 23, 2008: CN200710002415

The invention relates to a thin film enclosing structure of a fingerprint identifier, comprising a fingerprint identifier chip, a plurality of projecting blocks, a plurality of virtual projecting blocks, a circuit film and sealing colloids. A sensing area is formed on an active surface of the finger ...


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Huang Mingliang, Li Yaorong, Li Mingxun: Film packaging construction of fingerprint identification device. Chipmos Technologies, shouning zhanghua hui, July 23, 2008: CN200710002416

The invention relates to a film membrane sealing conformation for fingerprint identifiers, which comprises a fingerprint identifier wafer, a plurality of embossments, a circuit film membrane, a sealing colloid sealing the embossments and a metal base for fixedly combining the fingerprint identifier ...


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Huang Xiangming, Liu Anhong, Li Yizhang, Li Yaorong: Perpendicular detecting probe head, detecting probe head manufacturing method and modularized detecting probe card thereof. Chipmos Technologies, shouning zhanghua hui, February 6, 2008: CN200610099588

The present invention relates to a vertical type probe tip, a probe tip production method and a modularized probe card using the probe tip. The vertical type probe tip mainly comprises a basal plate, a circuit layer and a plurality of vertical type probes; wherein, the basal plate has a plurality of ...


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Li Yizhang, Liu Anhong, Wang Yonghe, Zhao Yongqing, Li Yaorong: Modular high frequency detection card. Chipmos Technologies, shou ning zhang huahui, February 28, 2007: CN200510093070

The invention relates to a modularized high-frequency detecting card, which comprises: one detecting panel, one circuit carrier plate, and one interface plate between them, wherein said detecting panel has dual contain holes at the back, while dual decouple elements are embedded into said holes to b ...



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