1
Leonard Hayden, Scott Rumbaugh, Mike Andrews: Probe for combined signals. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, April 20, 2004: US06724205 (98 worldwide citation)

A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test th ...


2
Leonard Hayden, Scott Rumbaugh, Mike Andrews: Probe for combined signals. Cascaded Microtech, Oyen Wiggs Green & Mutala, October 19, 2004: US06806724 (95 worldwide citation)

A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test th ...


3
K Reed Gleason, Tim Lesher, Eric W Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M E Safwat: Probe for testing a device under test. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, November 9, 2004: US06815963 (65 worldwide citation)

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.


4
K Reed Gleason, Tim Lesher, Eric W Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M E Safwat: Probe for testing a device under test. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, January 9, 2007: US07161363 (36 worldwide citation)

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.


5
Leonard Hayden, John Martin, Mike Andrews: Wafer probe. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, June 19, 2007: US07233160 (25 worldwide citation)

The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.


6
K Reed Gleason, Tim Lesher, Eric W Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M E Safwat: Shielded probe for high-frequency testing of a device under test. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, December 4, 2007: US07304488 (11 worldwide citation)

A shielded probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe may include a probe tip that extends through a dielectric substrate that supports on a first surface a signal path to test instrumentation and on a sec ...


7
Leonard Hayden, Scott Rumbaugh, Mike Andrews: Probe for combined signals. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, August 26, 2008: US07417446 (8 worldwide citation)

A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct ...


8
Leonard Hayden, Scott Rumbaugh, Mike Andrews: Probe for combined signals. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, November 18, 2008: US07453276 (8 worldwide citation)

A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct ...


9
Leonard Hayden, John Martin, Mike Andrews: Wafer probe. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, March 30, 2010: US07688097 (5 worldwide citation)

The present invention relates to a probe tip assembly for testing of integrated circuits or other microelectronic devices. The probe tip assembly may include a plurality of independently flexible contact fingers extending from a support, each contact finger spaced apart from the other contact finger ...


10
K Reed Gleason, Tim Lesher, Eric W Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M E Safwat: Shielded probe for testing a device under test. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, April 14, 2009: US07518387 (5 worldwide citation)

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.