1
Romarico S San Antonio, Michael H McKerreghan, Anang Subagio, Allan C Toriaga, Lenny Christina Gultom: RF shielding for a singulated laminate semiconductor device package. Unisem, Wiggin and Dana, December 27, 2011: US08084300 (20 worldwide citation)

A method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substrate is disposed on a tape; the mold ...


2
Shafidul Islam, Romarico Santos San Antonio, Lenny Christina Gultom: Taped lead frames and methods of making and using the same in semiconductor packaging. Unisem, White & Case, October 21, 2008: US07439097 (2 worldwide citation)

The invention provides a taped lead frame for use in manufacturing electronic packages. The taped lead frame is composed of a tape and a lead frame formed from a plurality of individual metal features attached to the tape and arranged in a footprint pattern. The method of making the invention enable ...


3
Shafidul Islam, Romarico Santos San Antonio, Lenny Christina Gultom: Taped lead frames and methods of making and using the same in semiconductor packaging. White & Case, March 25, 2004: US20040058478-A1

The invention provides a taped lead frame for use in manufacturing electronic packages. The taped lead frame is composed of a tape and a lead frame formed from a plurality of individual metal features attached to the tape and arranged in a footprint pattern. The method of making the invention enable ...


4
Shafidul Islam, Romarico Santos San Antonio, Lenny Christina Gultom: Taped lead frames and methods of making and using the same in semiconductor packaging. White & Case, January 5, 2006: US20060001130-A1

The invention provides a taped lead frame for use in manufacturing electronic packages. The taped lead frame is composed of a tape and a lead frame formed from a plurality of individual metal features attached to the tape and arranged in a footprint pattern. The method of making the invention enable ...


5