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Jean Pierre Joly, Laurent Ulmer, Guy Parat: Integrated circuit on high performance chip. Commissariat a l Energie Atomique, Brinks Hofer Gilson & Lione, November 1, 2011: US08048766 (30 worldwide citation)

A method of fabricating a die containing an integrated circuit, including active components and passive components, includes producing a first substrate containing at least one active component of active components and a second substrate containing critical components of the passive components, such ...


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Jean Pierre Joly, Laurent Ulmer, Guy Parat: Integrated circuit on high performance chip. Wrigley & Dreyfus 28455, Brinks Hofer Gilson & Lione, November 9, 2006: US20060252229-A1

A method of fabricating a die containing an integrated circuit, including active components and passive components, includes producing a first substrate containing at least one active component of active components and a second substrate containing critical components of the passive components, such ...