1
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and method for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, October 31, 2006: US07129163 (44 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


2
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Sheer & Vaughn PLLC, March 24, 2009: US07508065 (36 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


3
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Sherr & Vaughn PLLC, November 11, 2008: US07449784 (35 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


4
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, February 12, 2008: US07329056 (13 worldwide citation)

Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the l ...


5
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Sherr & Vaughn PLLC, February 15, 2011: US07888793 (7 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


6
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Niels Haun, Dann Dorfman Herrell & Skillman PC, April 22, 2014: US08703603 (2 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


7
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Rohm And Haas Electronic Materials, March 29, 2007: US20070072321-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


8
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Rohm And Haas Electronic Materials, July 19, 2007: US20070164419-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


9
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. April 7, 2011: US20110079893-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


10
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Rohm And Haas Electronic Materials, February 22, 2007: US20070040268-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...