1
Daniel J Woodruff, Kyle M Hanson: Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member. Semitool, Rockey Milnamow & Katz, June 27, 2000: US06080291 (190 worldwide citation)

A plating apparatus, such as for electroplating of semiconductor wafers or like workpieces, includes a plating contact including an annular contact ring having an annular mounting portion, and an annular electrically-conductive contact portion extending inwardly of the mounting portion. The contact ...


2
Daniel J Woodruff, Kyle M Hanson: Electroplating apparatus with segmented anode array. Harry M Cross, Polit & Associates, December 24, 2002: US06497801 (69 worldwide citation)

An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentri ...


3
Kyle M Hanson, Robert A Weaver, Jerry Simchuk, Raymon F Thompson: Diffuser with spiral opening pattern for an electroplating reactor vessel. Semitool, Perkins Coie, July 3, 2001: US06254742 (58 worldwide citation)

In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved ...


4
Kyle M Hanson, K Chris Haugan, Kevin W Coyle, James Doolittle, Robert W Berner: Cathode current control system for a wafer electroplating apparatus. Semitool, Rockey Milnamow & Katz, December 21, 1999: US06004440 (55 worldwide citation)

A cathode current control system employing a current thief for use in electroplating a wafer is set forth. The current thief comprises a plurality of conductive segments disposed to substantially surround a peripheral region of the wafer. A first plurality of resistance devices are used, each associ ...


5
Martin C Bleck, Lyndon W Graham, Kyle M Hanson: Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover. Semitool, Rockey Milnamow & Katz, November 16, 1999: US05985126 (54 worldwide citation)

A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which ...


6
Daniel J Woodruff, Kyle M Hanson, Thomas H Oberlitner, LinLin Chen, John M Pedersen, Vladimir Zila: Methods and apparatus for processing the surface of a microelectronic workpiece. Semitool, Perkins Coie, October 30, 2001: US06309524 (53 worldwide citation)

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode with ...


7
Daniel J Woodruff, Kyle M Hanson, Thomas H Oberlitner, LinLin Chen, John M Pedersen, Vladimir Zila: Methods and apparatus for processing the surface of a microelectronic workpiece. Semitool, Perkins Coie, October 30, 2001: US06309520 (50 worldwide citation)

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode with ...


8
Daniel J Woodruff, Kyle M Hanson: Reactor vessel having improved cup anode and conductor assembly. Semitool, Perkins Coie, May 8, 2001: US06228232 (50 worldwide citation)

An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield carrying an anode, the anode shield ...


9
Kyle M Hanson, Scott Grace, Matt Johnson, Ken Gibbons: Apparatus for electrochemically processing a microelectronic workpiece. Semitool, Perkins Coie, April 9, 2002: US06368475 (46 worldwide citation)

A reactor for use in electrochemical processing of a microelectronic workpiece is set forth and described herein. The apparatus comprises one or more walls defining a processing space therebetween for containing a processing fluid. The processing space includes at least a first fluid flow region and ...


10
Daniel J Woodruff, Kyle M Hanson, Thomas H Oberlitner, LinLin Chen, John M Pedersen, Vladimir Zila: Methods and apparatus for processing the surface of a microelectronic workpiece. Semitool, Perkins Coie, www perkinscoie com, October 16, 2001: US06303010 (42 worldwide citation)

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode with ...