1
Osanai Katsunori, Kuwajima Hajime: Surface acoustic wave device. TDK, July 14, 2000: JP2000-196407 (9 worldwide citation)

PROBLEM TO BE SOLVED: To improve the service life of power resistance by making the heat conductivity of a highly heat conductive member higher than that of a piezoelectric substrate, on which the highly heat conductive member is provided, and surface acoustic wave(SAW) connecting surface constituti ...


2
Sekoguchi Hiroshi, Osanai Katsunori, Takahashi Masaki, Kuwajima Hajime: Surface acoustic wave device. TDK, June 30, 2000: JP2000-183680 (7 worldwide citation)

PROBLEM TO BE SOLVED: To prevent productivity from deteriorating and to avoid a surface acoustic wave device from being large in size when preventing destruction due to discharge of an interdigital transducer in the surface acoustic wave device, especially the surface acoustic wave device of a faced ...


3
Kuwajima Hajime, Sato Katsuo: Surface acoustic wave filter element, base substrate for surface acoustic wave filter element, and surface acoustic wave filter device with surface acoustic wave filter element. TDK, January 8, 2004: JP2004-007250 (7 worldwide citation)

PROBLEM TO BE SOLVED: To provide a surface acoustic wave device provided with a ladder type surface acoustic wave filter element for increasing an out-band attenuation while suppressing an in-band insertion loss.SOLUTION: In the surface acoustic wave device comprising the ladder type surface acousti ...


4
KUWAJIMA HAJIME, FUJIWARA TOSHIYASU, OHYAMA NAOTO, TSUYA YOSHIKAZU, SASAKI MASAMI: Coupleur directionnel et dispositif de communication sans fil, Richtungskoppler und drahtlose Kommunikationsvorrichtung, Directional coupler and wireless communication device. TDK, January 30, 2013: EP2551952-A2 (1 worldwide citation)

A directional coupler (11) according to the present invention includes a primary line (12) for transmitting a transmission signal an input port (P1) for inputting the transmission signal to the primary line an output port (P2) for outputting the transmission signal from the primary line a secondary ...


5
Goto Masashi, Kuwajima Hajime, Hara Hiroki, Yamamoto Hiroshi: Manufacturing method for electronic component, and electronic component. TDK, January 20, 2005: JP2005-019918 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component and an electronic component, which eliminate a need for an electroless plating process or other pre-processes similar to the same to simplify manufacturing processes, and suppress the unevenness of plating level by a ...


6
Kuwajima Hajime, Furuya Akira, Miyazaki Masahiro, Shibata Makoto: Electronic part. TDK, June 7, 2007: JP2007-142109 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide an electronic part having a capacitor in which it is possible to prevent an electromigration from occurring and the accuracy of a capacity value of a capacitor element is high.SOLUTION: The electronic part 1 has a lower conductor 21 formed on a substrate 51; a dielec ...


7
Kuwajima Hajime, Goto Masashi: Substrate, electronic component and method of manufacturing same. TDK, December 7, 2006: JP2006-332346 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide an effective method of manufacturing a substrate and an electronic component which is excellent in electrical reliability without executing an electroless plating process or the like.SOLUTION: Before an opening 28 formed in a base material 22 of an electronic compone ...


8
Kuwajima Hajime, Miyazaki Masahiro, Furuya Akira: Thin-film device and method of manufacturing same. TDK, pubai meng liuzong jie, July 4, 2007: CN200610156256

A thin-film device comprises: a substrate; a flattening film made of an insulating material and disposed on the substrate; and a capacitor provided on the flattening film. The capacitor incorporates: a lower conductor layer; a dielectric film disposed on the lower conductor layer; and an upper condu ...


9
Chen Qiang Richard, Kuwajima Hajime: Miniature thin-film bandpass filter. TDK, October 15, 2008: EP1979982-A1

A bandpass filter includes at least two thin-film layers, a first resonant circuit including a first inductor, and a second resonant circuit including a second inductor. In one embodiment, the first inductor comprises a coil having a counter-clockwise rotation positioned in two or more of the at lea ...


10
Gotoh Masashi, Kuwajima Hajime, Hara Hiroki, Yamamoto Hiroshi: (Ja) 電子部品の製造方法および電子部品, (En) Production method for electronic component and electronic component. Tdk Corporation, Gotoh Masashi, Kuwajima Hajime, Hara Hiroki, Yamamoto Hiroshi, OKABE Masao, December 23, 2004: WO/2004/112449

(EN) A production method for an electronic component by which a conductor connected from a lower-layer wiring is exposed to the upper-side surface of an insulating member covering the lower-layer wiring. The method forms a feed film on the upper-side surface of an insulating member, and then forms a ...



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