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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 31, 2013: US08618659 (70 worldwide citation)

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first ...


2
Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, November 8, 2012: US20120280386-A1

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first ...


3
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 29, 2015: US09224717 (33 worldwide citation)

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conduct ...


4
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 28, 2015: US09093435 (31 worldwide citation)

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conduct ...


5
Kato Yoshiro, Ohira Hiroshi, Osawa Masayuki, Iijima Asao, Kurosawa Inetaro: Method of manufacturing multilayered wiring board and metal sheet for forming wiring board. North, December 13, 2002: JP2002-359471 (10 worldwide citation)

PROBLEM TO BE SOLVED: To obtain a highly integrated multilayered wiring board having fine bumps. SOLUTION: A method of manufacturing multilayered wiring board includes at least a laminating step. In the step, a plurality of multilayered metal sheets 1 each of which is composed of a bump-forming meta ...


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Ohira Hiroshi, Kurosawa Inetaro, Osawa Masayuki, Iijima Asao: Member for wiring circuit and its manufacturing method, multilayer interconnection circuit board, and semiconductor integrated circuit device. North, May 17, 2002: JP2002-141629 (4 worldwide citation)

PROBLEM TO BE SOLVED: To improve reliability in continuity between the upper and lower wiring of a bump formed in a member for wiring circuits used for manufacturing a multilayer interconnection circuit board.SOLUTION: On one main surface of a metal plate 1 made of metal foil that provides a plurali ...


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Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, August 28, 2018: US10062661

Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectroni ...


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Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 27, 2017: US09691731

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conduct ...


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Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 3, 2015: US08969133

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conduct ...


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Iijima Tomoo, Kato Yoshiro, Odaira Hiroshi, Ohsawa Masayuki, Kurosawa Inetaro, Sakuma Kazuo, Asano Toshihiko, Endo Kimitaka: Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board, and metal sheet for producing wiring board. North, January 2, 2004: EP1377145-A1

A plurality of multi-layer metal plates (1) each being composed of a bump forming metal layer (2), an etching stop layer (3), and a wiring film forming metal layer (4), and in which a wiring film (4a) is formed from the wiring film forming metal layer and a bump 2a is formed from the bump forming me ...