1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Konstantine Karavakis: Method of making components with releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 20, 2004: US06763579 (18 worldwide citation)

A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer b ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Konstantine Karavakis: Components with releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 16, 2003: US06664484 (17 worldwide citation)

A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer b ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Konstantine Karavakis: Method of making components with releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 3, 2006: US07114250 (16 worldwide citation)

A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer b ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Konstantine Karavakis: Components with releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 23, 2002: US06423907 (16 worldwide citation)

A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer b ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Hamid Eslampour, Konstantine Karavakis: Components with releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2002: US06495462 (15 worldwide citation)

A microelectronic component is made by providing a starting structure having a dielectric layer and leads on a surface of the dielectric layer. Ends of the leads are connected to contacts on a microelectronic element, such as the contacts on a semiconductor chip or wafer. The dielectric layer is the ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Konstantine Karavakis: Method of making components with releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 6, 2003: US06557253 (13 worldwide citation)

A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer b ...


7
Belgacem Haba Belgacem (Bel) Haba
David Light, Belgacem Haba, Thomas H Distefano, Konstantine Karavakis: Manufacture of semiconductor connection components with frangible lead sections. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 14, 2001: US06274822 (6 worldwide citation)

A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating ...


8
Belgacem Haba Belgacem (Bel) Haba
Thomas H DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W Smith: Connection component with peelable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 27, 2006: US07067742 (5 worldwide citation)

A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support struc ...


9
Belgacem Haba Belgacem (Bel) Haba
Thomas H DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W Smith: Method of making connection component. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 19, 2002: US06357112 (4 worldwide citation)

A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Konstantine Karavakis: Components with releasable leads. Lerner David Littenberg Krumholz & Mentlik, August 14, 2003: US20030150111-A1

A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer b ...