1
Koji Fujisaki, Akio Nishikawa, Shunichi Numata, Hiroshi Suzuki, Takeshi Komaru, Daisuke Makino: Resin encapsulated semiconductor device. Hitachi, Hitachi Chemical, Antonelli Terry & Wands, July 19, 1988: US04758875 (59 worldwide citation)

Disclosed is a resin encapsulated semiconductor memory device comprising a semiconductor memory element, a package encapsulating the memory element and an .alpha.-rays shielding layer made from a water-resistant aromatic polyimide polymer, interposed between the memory element and the package, the a ...


2
Shun ichi Numata, Koji Fujisaki, Noriyuki Kinjo, Junichi Imaizumi, Yoshikatsu Mikami: Low thermal expansion resin material and composite shaped article. Hitachi, Hitachi Chemical, Antonelli Terry & Wands, September 1, 1987: US04690999 (29 worldwide citation)

A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and ca ...


3
Shun ichi Numata, Koji Fujisaki, Noriyuki Kinjo, Junichi Imaizumi, Yoshikatsu Mikami: Low thermal expansion resin material and composite shaped article. Hitachi, Hitachi Chemical Co, Antonelli Terry & Wands, December 20, 1988: US04792476 (23 worldwide citation)

A resin material comprising a polyamide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and ca ...


4
Shunichi Numata, Koji Fujisaki, Noriyuki Kinjo: Fluorine-containing polyamide-acid derivative and polyimide. Hitachi, Hitachi Chemical, Antonelli Terry & Wands, July 26, 1988: US04760126 (18 worldwide citation)

A polyimide or polyamic acid synthesized from a diamine, which may be fluorinated, and a dianhydride of the following formula: ##STR1## where R.sub.f =perfluoroalkylene and Y.sub.1 and Y.sub.2 are independently oxy-carbonyl or thiocarbonyl.


5
Shunichi Numata, Ikeda Takayoshi, Koji Fujisaki, Takao Miwa, Noriyuki Kinjo: Method for forming polyimide film by chemical vapor deposition. Hitachi, Antonelli Terry & Wands, July 26, 1988: US04759958 (15 worldwide citation)

A method for forming a polyimide film on a substrate surface by chemical vapor deposition comprises evaporating an aromatic monomer compound having one amino group and two adjacent carboxyl groups or its derivative group, such as esters of 4-amino phthalic acid, and 4-(p-anilino) phthalic acid, thus ...


6
Koji Fujisaki, Shunichi Numata, Takao Miwa, Takayoshi Ikeda, Hisae Shimanoki: Process of forming a patterned polyimide film and articles including such a film. Hitachi, Antonelli Terry Stout & Kraus, May 4, 1993: US05208066 (12 worldwide citation)

A process of forming a patterned polyimide film includes the step of conversion of a polyimide precursor into polyimide. The improvement is imidizing the precursor by means of a chemical imidizing reagent. Typically a film of polyimide precursor is formed on a substrate, and mask which is negative w ...


7
Shunichi Numata, Takao Miwa, Takayoshi Ikeda, Koji Fujisaki, Hisae Shimanoki, Kunio Miyazaki, Osamu Miura, Ryuji Watanabe, Toshio Miyamoto, Yukio Okoshi: Process for producing metal-polyimide composite article. Hitachi, Antonelli Terry Stout & Kraus, July 28, 1992: US05133989 (6 worldwide citation)

The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The ...


8
Rie Tawata, Shunichi Numata, Takao Miwa, Koji Fujisaki, Takayoshi Ikeda, Yoshiaki Okabe, Hisae Shimanoki: Method for forming multilayer wiring construction. Hitachi, Antonelli Terry Stout & Kraus, November 5, 1996: US05570506 (4 worldwide citation)

Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible ...


9
Toshiaki Akutsu, Hisataka Minami, Tomohiro Iwano, Koji Fujisaki: Polishing agent, polishing agent set and method for polishing base. HITACHI CHEMICAL COMPANY, Fitch Even Tabin & Flannery, October 20, 2015: US09163162 (2 worldwide citation)

A polishing agent according to one embodiment of the present invention contains a liquid medium, an abrasive grain including a hydroxide of a tetravalent metal element, a polymer compound having an aromatic ring and a polyoxyalkylene chain, and a cationic polymer, wherein a weight average molecular ...


10
Tomohiro Iwano, Hisataka Minami, Toshiaki Akutsu, Koji Fujisaki: Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate. HITACHI CHEMICAL COMPANY, Fitch Even Tabin and Flannery, May 24, 2016: US09346978 (1 worldwide citation)

A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjuste ...