1
Yasuhiro Sugaya, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Satoru Yuuhaku, Toshiyuki Asahi: Circuit component built-in module, radio device having the same, and method for producing the same. Matsushita Electric Industrial, Merchant & Gould P C, March 25, 2003: US06538210 (96 worldwide citation)

A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module


2
Junichi Kato, Osamu Inoue, Seiichi Nakatani, Koichi Hirano, Toshiyuki Asahi: Magnetic element and method of manufacturing the same. Matsushita Electric Industrial, Merchant & Gould PC, May 21, 2002: US06392525 (68 worldwide citation)

A magnetic element including: a composite magnetic member A containing a metallic magnetic powder in an amount of 50-70 vol. % and a thermosetting resin in an amount of 50-30 vol. %; a magnetic member B that is at least one selected from a ferrite sintered body and a pressed-powder magnetic body of ...


3
Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano, Osamu Shibata, Takeshi Nakayama, Yoshiyuki Saito: Method for producing connection member. Panasonic Corporation, Wenderoth Lind & Ponack L, July 6, 2010: US07748110 (39 worldwide citation)

A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surf ...


4
Toshihiro Sawa, Tsuneo Kume, Koichi Hirano: Power converting apparatus and method using a multiple three-phase PWM cycloconverter system. Kabushiki Kaisha Yaskawa Denki, Oblon Spivak McClelland Maier & Neustadt P C, October 19, 1999: US05969966 (34 worldwide citation)

A power converting apparatus and a power converting method for driving a high voltage AC motor at a variable speed. Conventional invertor systems cannot solve technical subjects such as energy conservation, resource conservation, miniaturization, efficiency promotion and voltage and current waveform ...


5
Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano, Osamu Shibata, Takeshi Nakayama, Yoshiyuki Saito: Connection member and mount assembly and production method of the same. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, August 21, 2007: US07258549 (25 worldwide citation)

A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surf ...


6
Seiichi Nakatani, Koichi Hirano, Mikinari Shimada, Yasuhiro Sugaya: Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same. Matsushita Electric Industrial, Merchant & Gould P C, February 25, 2003: US06525921 (25 worldwide citation)

A capacitor-mounted metal foil of the present invention is provided with a metal foil and a plurality of capacitors formed on the metal foil. Each of the capacitors includes a conductive layer disposed above the metal foil, and a dielectric layer disposed between the metal foil and the conductive la ...


7
Koichi Hirano, Seiichi Nakatani: Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection. Matsushita Electric Industrial, Merchant & Gould PC, November 26, 2002: US06486006 (24 worldwide citation)

A thermal conductive sheet including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes are formed in the thermal conductive sheet and a conductive resin composition is filled ...


8
Koichi Hirano, Tsunenori Yoshida, Seiichi Nakatani: Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor. Matsushita Electric Industrial, Hamre Schumann Mueller & Larson P C, January 15, 2008: US07319599 (23 worldwide citation)

A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The layer incorporating the capacitor ...


9
Yoshihisa Yamashita, Koichi Hirano, Yasuhiro Sugaya, Toshiyuki Asahi, Seiichi Nakatani: Electronic component built-in module and method of manufacturing the same. Matsushita Electric Industrial, Hamre Schumann Mueller & Larson P C, July 1, 2008: US07394663 (21 worldwide citation)

An electronic component built-in module according to the present invention includes a pair of opposed circuit substrates, each of which includes a wiring pattern and an insulating base material containing a resin, an insulating layer that is placed between the pair of circuit substrates and contains ...


10
Koichi Hirano, Yoshihisa Yamashita, Seiichi Nakatani: Thermal conductive substrate and semiconductor module using the same. Matsushita Electric Industrial, Hamre Schumann Mueller & Larson P C, October 25, 2005: US06958535 (19 worldwide citation)

A semiconductor module includes a circuit substrate composed of a wiring pattern, an electrical insulating layer and a thermal radiation board, and in use is fixed to an external thermal radiation member, in which the electrical insulating layer is composed of a thermal conductive mixture containing ...