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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Klaus Jurgen Wolter: Microelectronic joining processes with bonding material application. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 10, 2002: US06492251 (42 worldwide citation)

A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part by a flexible film. Atmospheric pressure on th ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Klaus Jurgen Wolter: Joining semiconductor units with bonding material. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 15, 2004: US06750539 (22 worldwide citation)

A unit includes one or more semiconductor chips. Each chip has a front surface with a plurality of contacts surrounded by a passivated surface. The passivated surface is not wettable by bonding material. The contacts have masses of bonding material thereon and the masses have a height less than the ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba, Klaus Jurgen Wolter: Microelectronic joining processes. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 25, 2003: US06651321 (18 worldwide citation)

A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Klaus Jurgen Wolter: Joining semiconductor units with bonding material. Lerner David Littenberg Krumholz & Mentlik, July 24, 2003: US20030139029-A1

A unit includes one or more semiconductor chips. Each chip has a front surface with a plurality of contacts surrounded by a passivated surface. The passivated surface is not wettable by bonding material. The contacts have masses of bonding material thereon and the masses have a height less than the ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba, Klaus Jurgen Wolter: Microelectronic joining processes. Lerner David Littenberg Krumholz & Mentlik, March 6, 2003: US20030041451-A1

A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part by a flexible film. Atmospheric pressure on th ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba, Klaus Jurgen Wolter: Microelectronic joining processes. Tessera, Lerner David Litenberg Krumholz & Mentlik, February 26, 2004: US20040035519-A1

A microelectronic element is with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and ...