1
Kishor V Desai, Nelson P Franchak, Robert H Katyl, Harold Kohn, Tamar A Sholtes, Vilakkudi G Veeraraghavan, Charles G Woychik: Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate. International Business Machines Corporation, Pollock Vande Sande & Priddy, October 27, 1992: US05159535 (112 worldwide citation)

Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect ...


2
Kishor V Desai, Thomas G Macek, Maganlal S Patel, Edwin L Thomas: High density, separable connector and contact for use therein. International Business Machines Corporation, Lawrence R Fraley, August 11, 1992: US05137456 (86 worldwide citation)

An electrical connector for interconnecting a pair of circuit members (e.g., printed circuit boards) wherein the connector includes a plurality of electrical contacts, these contacts including at least one semi-spherical end portion for engaging a respective conductor on one of the circuit members. ...


3
Kishor V Desai, Sunil A Patel, John P McCormick: Die clip assembly for semiconductor package. LSI Logic Corporation, December 26, 2000: US06166434 (70 worldwide citation)

Provided is a die clip for use in semiconductor flip chip packaging as a replacement for the conventional combination of a heat spreader and stiffener, a packaging method using the die clip, and a semiconductor package incorporating the die clip. In a preferred embodiment, the die clip is a piece of ...


4
Harold Kohn, Kishor V Desai, Ronald J Romanosky, George J Saxenmeyer Jr, Reinhold E Tomek, James R Webb: Electrical assembly with flexible circuit. International Business Machines Corporation, Lawrence R Fraley, April 6, 1993: US05199879 (66 worldwide citation)

An electrical assembly which includes a first circuit member (e.g., TCM) with at least one conductive pin projecting therefrom for being frictionally and electrically engaged by a flexible portion of circuit means of a second circuit member (e.g., PCB). An opening is provided within the PCB relative ...


5
Kishor V Desai, Amit K Sarkhel: Substrate structure and method for improving attachment reliability of semiconductor chips and modules. International Business Machines Corporation, Lawrence R Fraley, Ratner & Prestia, December 14, 1999: US06002172 (52 worldwide citation)

An adhesion pad for adhering a semiconductor chip or a ball grid array module to a supporting substrate includes a stepped or tapered structure. The structure is composed of at least one solder wettable metal or alloy layer having solder deposited thereon. The stepped or tapered structure prevents a ...


6
Timothy F Carden, Glenn O Dearing, Kishor V Desai, Stephen R Engle, Randall Stutzman, George H Thiel: High performance chip packaging and method. International Business Machines Corporation, Lawrence R Fraley, Schmeiser Olsen & Watts, April 22, 2003: US06552266 (51 worldwide citation)

A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment d ...


7
Maniam Alagaratnam, Kishor V Desai, Sunil A Patel: Interposer for semiconductor package assembly. LSI Logic Corporation, Beyer Weaver & Thomas, January 1, 2002: US06335491 (49 worldwide citation)

The present invention describes an interposer which improves the thermal performance of a semiconductor device. The interposer may be situated between a substrate and a board. The interposer is attached to two layers of solder balls. The first layer of solder balls electrically and mechanically conn ...


8
Kishor V Desai, Kohn Harold: Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate. International Business Machines Corporation, David L Adour, December 6, 1988: US04788767 (48 worldwide citation)

A method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package, such that the flexible film of the carrier is supported substantially in a plane above the surface of the second level electronic package. The method comprises positioni ...


9
Kishor V Desai, Joseph Hromek: Apparatus and method for burn-in and testing of devices with solder bumps or preforms. International Business Machines Corporation, Larry Fraley Esq, Whitham Curtis & Whitham, March 9, 1999: US05880590 (38 worldwide citation)

Temporary connections are formed to a flip-chip style chip having solder bumps or preforms protruding therefrom for testing and burn-in while avoiding distortion of the solder bumps or preforms and avoiding wear and damage to a test or burn-in jig such as a ball grid array by the use of a preferably ...


10
Kishor V Desai, Amit K Sarkhel: Substrate structure for improving attachment reliability of semiconductor chips and modules. International Business Machines Corporation, Lawrence R Fraley Esq, Ratner & Prestia, August 28, 2001: US06281581 (34 worldwide citation)

An adhesion pad for adhering a semiconductor chip or a ball grid array module to a supporting substrate includes a stepped or tapered structure. The structure is composed of at least one solder wettable metal or alloy layer having solder deposited thereon. The stepped or tapered structure prevents a ...