1
Yinon Degani, Thomas D Dudderar, Byung J Han, Alan M Lyons, King L Tai: Packaging multi-chip modules without wire-bond interconnection. Lucent Technologies, Oleg E Alber, Robert E Rudnick, March 4, 1997: US05608262 (210 worldwide citation)

Described is a novel packaging of MCM tiles without wire-bond interconnections and in a total thickness which is reduced relative to conventional MCM packaging. The MCM tile includes a substrate with a plurality of peripheral metallizations and at least one chip flip-chip mounted on the substrate. T ...


2
Robert C Frye, King L Tai: Method for making multichip circuits using active semiconductor substrates. AT&T, Glen E Books, July 9, 1996: US05534465 (146 worldwide citation)

In accordance with the invention, a multichip circuit is fabricated by providing an active semiconductor substrate comprising a set of isolated components including active components such as transistors, forming on a surface of the substrate a plurality of paths incorporating components from the sub ...


3
King L Tai: Integrated circuit chip-and-substrate assembly. American Telephone and Telegraph Company, AT&T Bell Laboratories, Peter A Businger, June 2, 1987: US04670770 (116 worldwide citation)

In the interest of enhanced yield in the manufacture of "wafer-scale" integrated circuits an assembly of integrated circuit chips is made by placing chips on a substrate. Chips have beveled edges as produced by crystallographically anisotropic chemical etching, and the substrate has wells, grooves, ...


4
Avishay Katz, Chien Hsun Lee, King L Tai: Debondable metallic bonding method. AT&T Bell Laboratories, David I Caplan, August 10, 1993: US05234149 (77 worldwide citation)

One or more metallized chip terminals of an electronic device, such as an integrated circuit chip or a laser chip, in one embodiment are temporarily bonded to one or more metallized substrate pads of a wiring substrate, as for the purpose of electrically testing the electronic device. The compositio ...


5
Robert C Frye, Maureen Y Lau, King L Tai: Temporary connections for fast electrical access to electronic devices. AT&T, David I Caplan, January 2, 1996: US05481205 (60 worldwide citation)

A given testing substrate for fast-testing many integrated-circuit electronic devices, one after the other, has a set of mutually insulated collated wiring areas that can be aligned with solder-bump I/O pads of the electronic devices. At the surface of each of the corrugated areas is located a layer ...


6
King L Tai, John Thomson Jr: Integrated circuit package and compact assemblies thereof. AT&T Bell Laboratories, Glenn E Books, August 27, 1991: US05043794 (47 worldwide citation)

In accordance with the present invention, an integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conduct ...


7
Joseph H Condon, Robert C Frye, Thaddeus J Gabara, King L Tai, Scott C Knauer deceased, Carroll H Knauer executor: Multi-chip modules having chip-to-chip interconnections with reduced signal voltage level and swing. AT&T IPM, David I Caplan, October 24, 1995: US05461333 (44 worldwide citation)

A multi-chip module is composed of two or more integrated-circuit chips located on a substrate such as a dielectrically coated silicon substrate. The chips are interconnected by means of transmission wiring lines. At least some of the chips contain one or more input buffer circuits, each composed of ...


8
Donlad D Bacon, Avishay Katz, Chien Hsun Lee, King L Tai, Yiu Man Wong: Permanent metallic bonding method. AT&T Bell Laboratories, David I Caplan, August 10, 1993: US05234153 (36 worldwide citation)

A laser device is bonded to a diamond submount by means of a procedure including (1) codepositing an auxiliary layer, on a layer of barrier metal that has been deposited overlying the submount, followed by (2) depositing a wetting layer on the auxiliary layer, and (3) by depositing a solder layer co ...


9
Avishay Katz, Chien Hsun Lee, King L Tai, Yiu Man Wong: Bonding method using solder composed of multiple alternating gold and tin layers. D I Caplan, March 30, 1993: US05197654 (31 worldwide citation)

A device such as a laser is bonded to a submount such as diamond by a process in which the submount is successively coated with an adhesion layer such as titanium, a barrier layer such as nickel, and a gold-tin solder-metallization composite layer formed by sequential deposition on the barrier layer ...


10
Yinon Degani, Thomas D Dudderar, King L Tai: Method and apparatus for assembling multichip modules. Lucent Technologies, Samuel R Williamson, October 15, 1996: US05564617 (25 worldwide citation)

A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such a multichip module. The disclosed assembly process makes the heretofore difficult a ...