1
Belgacem Haba Belgacem (Bel) Haba
Chang Myung Ryu, Kimitaka Endo, Belgacem Haba, Yoichi Kubota: Microelectronic interconnect element with decreased conductor spacing. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, June 11, 2013: US08461460

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Chang Myung Ryu, Kimitaka Endo, Christopher Paul Wade: Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer. Tessera Interconnect Materials, Tessera, LERNER DAVID et al, February 25, 2010: US20100044860-A1

An interconnection element can include a substrate, e.g., a connection substrate, element of a package, circuit panel or microelectronic substrate, e.g., semiconductor chip, the substrate having a plurality of metal conductive elements such as conductive pads, contacts, bond pads, traces, or the lik ...


3
Belgacem Haba Belgacem (Bel) Haba
Chang Myung Ryu, Kimitaka Endo, Belgacem Haba, Yoichi Kubota: Microelectronic interconnect element with decreased conductor spacing. Tessera, Tessera, LERNER DAVID et al, January 14, 2010: US20100009554-A1

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


4
Belgacem Haba Belgacem (Bel) Haba
Kimitaka Endo, Philip Damberg, Craig S Mitchell, Sean Moran, Christopher Wade, Belgacem Haba, John Riley: Multilayer substrate with interconnection vias and method of manufacturing the same. Tessera, Tessera, LERNER DAVID et al, March 19, 2009: US20090071707-A1

A method is provided for manufacturing a multilayer substrate. An insulating layer can have a hole overlying a patterned second metal layer. In turn, the second metal layer can overlie a first metal layer. A third metal layer can be electroplated onto the patterned second metal layer within the hole ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Vage Oganesian, Kimitaka Endo: Robust multi-layer wiring elements and assemblies with embedded microelectronic elements. Tessera, Tessera, LERNER DAVID et al, May 7, 2009: US20090115047-A1

An interconnect element 130 can include a dielectric layer 116 having a top face 116b and a bottom face 116a remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, ...


6
Kimitaka Endo: Interconnection element for electric circuits. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, October 30, 2012: US08299368 (32 worldwide citation)

An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ...


7
Kimitaka Endo: Bump structure formed from using removable mandrel. Tessera Interconnect Materials, Lerner David Littenberg Krumholz & Mentlik, February 21, 2012: US08119516 (24 worldwide citation)

A method for forming a bump structure and a bump structure for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon, used as an electric connection in an electronic circuit, includes the steps of forming a mandrel by steps including forming ...


8
Tomoo Iijima, Kimitaka Endo: Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate. North Corporation, Armstrong Kratz Quintos Hanson & Brooks, April 26, 2005: US06884709 (23 worldwide citation)

A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be lami ...


9
Takashi Imaeda, Kimitaka Endo, Jouji Nakayama, Tetsuya Yamamoto, Ken ichiro Shimokura, Tsutomu Yabuuchi, Hirohisa Tezuka, Masato Urano: Database access control method, database access controller, agent processing server, database access control program, and medium recording the program. Nippon Telegraph and Telephone Corporation, Oblon Spivak McClelland Maier & Neustadt P C, November 18, 2008: US07454421 (6 worldwide citation)

A database access control apparatus generates and stores an access key based on a user ID of a user apparatus. Then, the database access control apparatus sends the access key to the user apparatus with an address of a proxy process server apparatus. The user apparatus sends the access key to the pr ...


10
Tomoo Iijima, Kimitaka Endo: Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate. Tessera Interconnect Materials, Lerner David Littenberg Krumholz & Mentlik, July 3, 2007: US07238603 (6 worldwide citation)

A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be lami ...