1
Min Yoo, Ki Wook Lee, Min Jae Lee: Semiconductor devices and fabrication methods thereof. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, November 30, 2010: US07843052 (38 worldwide citation)

Semiconductor devices are disclosed. In an embodiment, a plurality of second semiconductor dies formed with through-silicon vias are stacked on a first semiconductor die. The stack of the second semiconductor dies is encapsulated by an encapsulant. Redistribution layers are formed on one surface of ...


2
Ki Wook Lee: Carrier frame and semiconductor package including carrier frame. Amkor Technology, Weiss Moy & Harris P C, August 3, 2004: US06770961 (25 worldwide citation)

A carrier frame and semiconductor package including a carrier frame provide improved thermal performance and mechanical stability for semiconductor packages using thin substrate materials. A metal carrier frame is attached to a substrate to provide support during and after the manufacturing process. ...


3
Jung Woo Park, Ki Wook Lee, Dong Wook Kim: Electric power converting device and power converting method for controlling doubly-fed induction generator. Korea Electrotechnology Research Institute, Frommer Lawrence & Haug, Ronald R Santucci, August 25, 2009: US07579702 (24 worldwide citation)

Disclosed herein is an electric power converting device and power converting method for controlling doubly-fed induction generators, which provides a synchronous generator for generating auxiliary electric power independently of a doubly-fed induction generator so as to generate electricity even in ...


4
Jung Woo Park, Ki Wook Lee, Dong Wook Kim: Controller of doubly-fed induction generator. Korean Electro Technology Research Institute, Robert E Bushnell Esq, December 29, 2009: US07638983 (18 worldwide citation)

Disclosed is a controller of a grid coupled type doubly-fed induction generator having a multi-level converter topology, which can control the doubly-fed induction generator having a high voltage specification and can perform a fault ride-through function, an anti-islanding function and a grid volta ...


5
Robert Francis Darveaux, Michael Barrow, Miguel Angel Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee, Ju Hoon Yoon: Exposed die overmolded flip chip package and fabrication method. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, March 1, 2011: US07898093 (18 worldwide citation)

An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal su ...


6
Robert Francis Darveaux, Michael Barrow, Miguel Angel Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee, Ju Hoon Yoon: Exposed die overmolded flip chip package and fabrication method. Amkor Technology, McKay and Hodgson, Serge J Hodgson, July 2, 2013: US08476748 (5 worldwide citation)

An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal su ...


7
Michael G Kelly, Ki Wook Lee, Chang Ho Jang: Thermally enhanced semiconductor package. Amkor Technology, Weiss & Moy P C, June 30, 2009: US07554194 (5 worldwide citation)

A semiconductor package has a substrate having a first surface, a second surface, and a through hole opening. A heat spreader has a first surface, a second surface, and a plurality of notches formed on the second surface. A semiconductor die is coupled to the first surface of the heat spreader. The ...


8
Robert Francis Darveaux, Michael Barrow, Miguel Angel Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee, Ju Hoon Yoon: Exposed die overmolded flip chip package. Amkor Technology, McKay and Hodgson, Serge J Hodgson, February 5, 2013: US08368194 (4 worldwide citation)

An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal su ...


9
Ki Wook Lee: Semiconductor package and fabrication method thereof. Amkor Technology, Weiss & Moy P C, April 5, 2011: US07919853 (4 worldwide citation)

A semiconductor package and method of manufacture has a substrate having an aperture. A semiconductor die is positioned in the aperture of the substrate and attached to a heat spreader by a first adhesive and electrically coupled to the substrate by at least one conductive wire. The heat spreader sp ...


10
Robert Francis Darveaux, Michael Barrow, Miguel Angel Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee, Ju Hoon Yoon: Exposed die overmolded flip chip package and fabrication method. McAndrews Held & Malloy, September 30, 2014: US08847372 (3 worldwide citation)

An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal su ...