1
James E O Toole, John R Tuttle, Mark E Tuttle, Tyler Lowrey, Kevin M Devereaux, George E Pax, Brian P Higgins, David K Ovard, Shu Sun Yu, Robert R Rotzoll: Radio frequency data communications device. Micron Technology, Wells St John Roberts Gregory & Matkin P S, October 10, 2000: US06130602 (292 worldwide citation)

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receive ...


2
James E O&apos Toole, John R Tuttle, Mark E Tuttle, Tyler Lowrey, Kevin M Devereaux, George E Pax, Brian P Higgins, David K Ovard, Shu Sun Yu, Robert R Rotzoll: Radio frequency data communications device. Micron Technology, Wells St John P S, May 11, 2004: US06735183 (113 worldwide citation)

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receive ...


3
Kevin M Devereaux, Mark Bunn, Brian Higgins: Fixture for burn-in testing of semiconductor wafers. Micron Technology, Wells St John Roberts Gregory & Matkin, October 24, 1995: US05461328 (88 worldwide citation)

A semiconductor wafer has multiple individual dies containing integrated circuits arrayed for singulation and test cycling circuitry for test cycling individual dies. A passivation layer overlies the dies, with contact openings being provided through the passivation layer to Vcc and Vss pads. The se ...


4
Kevin M Devereaux, Mark Bunn, Brian Higgins: Method of testing individual dies on semiconductor wafers prior to singulation. Micron Technology, Wells St John Roberts Gregory & Matkin, January 18, 1994: US05279975 (69 worldwide citation)

A method of processing and testing a semiconductor wafer containing an array of integrated circuit dies comprises: a) providing die test cycling circuitry on the wafer b) etching contact openings through a passivation layer atop the wafer to Vcc and Vss pads associated with individual dies; c) patte ...


5
James E O&apos Toole, John R Tuttle, Mark E Tuttle, Tyler E Lowrey, Kevin M Devereaux, George E Pax, Brian P Higgins, Shu Sun Yu, David K Ovard, Robert R Rotzoll: Radio frequency data communications device. Micron Technology, Wells St John P S, December 28, 2004: US06836472 (51 worldwide citation)

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receive ...


6
James E O&apos Toole, John R Tuttle, Mark E Tuttle, Tyler Lowery, Kevin M Devereaux, George E Pax, Brian P Higgins, David K Ovard, Robert R Rotzoll, Shu Sun Yu: Radio frequency data communications device. Micron Technology, Wells St John Roberts Gregory & Matkin P S, November 13, 2001: US06316975 (40 worldwide citation)

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receive ...


7
James E O&apos Toole, John R Tuttle, Mark E Tuttle, Tyler Lowrey, Kevin M Devereaux, George E Pax, Brian P Higgins, David K Ovard, Shu Sun Yu, Robert R Rotzoll: Radio frequency data communications device. Micron Technology, Wells St John P S, April 13, 2004: US06721289 (39 worldwide citation)

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receive ...


8
James E O&apos Toole, John R Tuttle, Mark E Tuttle, Tyler Lowrey, Kevin M Devereaux, George E Pax, Brian P Higgins, David K Ovard, Shu Sun Yu, Robert R Rotzoll: Radio frequency data communications device. Micron Technology, Wells St John P S, July 29, 2003: US06600428 (38 worldwide citation)

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receive ...


9
James E O&apos Toole, John R Tuttle, Mark E Tuttle, Tyler Lowrey, Kevin M Devereaux, George E Pax, Brian P Higgins, David K Ovard, Shu Sun Yu, Robert R Rotzoll: Radio frequency data communications device. Micron Technology, Wells St John P S, August 3, 2004: US06771613 (38 worldwide citation)

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receive ...


10
James E O&apos Toole, John R Tuttle, Mark E Tuttle, Tyler Lowrey, Kevin M Devereaux, George E Pax, Brian P Higgins, David K Ovard, Shu Sun Yu, Robert R Rotzoll: Radio frequency data communications device. Micron Technology, Wells St John Roberts Gregory & Matkin P S, October 15, 2002: US06466634 (36 worldwide citation)

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receive ...