1
Kevin Haley, Mostafa Aghazadeh, Hong Xie: Apparatus for dissipating heat in a hinged computing device. Intel Corporation, Blakely Sokoloff Taylor & Zafman, April 15, 1997: US05621613 (68 worldwide citation)

A heat transfer apparatus providing thermal coupling between a first and a second hinged member. The first hinged member is a first computer housing member, and the second hinged member is a second computer housing member. The first and the second computer housing members are rotatably attached allo ...


2
Rakesh Bhatia, Kevin Haley: Heat pipe exchanger system for cooling a hinged computing device. Intel Corporation, Blakely Sokoloff Taylor & Zafman, July 8, 1997: US05646822 (63 worldwide citation)

A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edges. A heat exchan ...


3
Kevin Haley: Tape BGA package die-up/die down. Intel Corporation, Blakely Sokoloff Taylor & Zafman, April 9, 1996: US05506756 (58 worldwide citation)

A ball grid array (BGA) package which contains an integrated circuit die that is directly mounted to either a heat sink or a printed circuit board. In one embodiment, the package has an integrated circuit with surface pads that are coupled to a flexible circuit board. Solder balls are attached to th ...


4
Michael O Connor, Kevin Haley, Rakesh Bhatia, Daniel Thomas Adams, Michael Andrew Kast: Cooling system for thin profile electronic and computer devices. Intel Corporation, Blakely Sokoloff Taylor & Zafman, October 12, 1999: US05966286 (35 worldwide citation)

An apparatus and method for removing heat from a heat generating component located within a thin-profile consumer electronic or computer system enclosure is disclosed. In one embodiment the cooling system of the present invention includes an air duct comprising a thermally conductive housing having ...


5
Rakesh Bhatia, Kevin Haley: Heat pipe exchanger system for cooling a hinged computing device. Intel Corporation, Blakely Sokoloff Taylor & Zafman, February 17, 1998: US05718282 (30 worldwide citation)

A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edge. A heat exchang ...


6
Kevin Haley, Michael O Connor, Rakesh Bhatia: Cooling system for integrated circuit chips in a portable computer lid assembly. Intel Corporation, Blakely Sokoloff Taylor & Zafman, November 9, 1999: US05982617 (27 worldwide citation)

A computer system, such as a notebook computer, that includes a lid having integrated circuit components that require heat dissipation while protecting the screen display of the lid.


7
Frank Kolman, Kevin Haley: Method of making solder shape array package. Intel Corporation, Blakely Sokoloff Taylor & Zafman, July 2, 1996: US05531021 (24 worldwide citation)

A surface mount package for an electronic device has an array of solder shapes or structures projecting from the bottom surface of the package. The solder structures are cast in place on the package substrate using a wave solder process. The solder also fills via holes in the substrate at each solde ...


8
Kevin Haley, Michael O&apos Connor, Rakesh Bhatia: Cooling system for integrated circuit chips in a portable computer. Intel Corporation, Blakely Sokoloff Taylor & Zafman, January 30, 2001: US06181555 (18 worldwide citation)

A computer system, such as a notebook computer, that includes a lid having integrated circuit components that require heat dissipation while protecting the screen display of the lid.


9
Eric J Hansen, Kevin Haley, Jesse J Williams, Herbert J VanderBilt, Michael R Foote, Donald J Mahaffy: Manual sprayer with dual bag-on-valve assembly. BISSELL Homecare, McGarry Bair PC, June 28, 2011: US07967220 (17 worldwide citation)

A manual spray dispenser for dispensing a mixture of two compositions comprises a container having a first and second chamber and a single dispensing spray outlet for dispensing controlled amounts of liquids from each of the first and second chambers. At least one of the chambers has a separator in ...


10
Kevin Haley: Apparatus for surface mounting an integrated circuit package. Intel Corporation, Blakely Sokoloff Taylor & Zafman, April 9, 1991: US05006962 (15 worldwide citation)

An apparatus for surface mounting an integrated circuit package onto a printed circuit board. Cantilever beams from a housing member extend inwardly toward a central opening and reside upon portion of the lead making contact to the printed circuit board. A tightening of the housing member onto the c ...